Research on the effect of bonding properties of micro bumps for different morphology and interconnection methods

Abstract

As the copper pillar bumps with fine pitch and high density were widely applied in high I/O interconnection packaging. It’s increasingly important to study the effect of bonding properties of copper pillar bumps for different morphology and interconnection methods. In the paper, we designed Test Vehicle of copper pillar bumps and manufacture $30 \mu \mathrm{m}$ pitch copper pillar bumps for verifying the bonding effect between copper pillar bumps. We compared the bonding experiments of copper pillar bumps of different exterior morphology and different bonding methods. Finally, using the four-probe method to test the resistance of the bonded bumps and the bonding yield of partial micro bumps can roughly be evaluated by has been designed daisy chain structure.