Reproduction Analysis of Fatigue Crack Networks in Sn-Ag-Cu Die Attach Joint by FEA

Hiroki Kanai, Y. Kariya, Yoshiki Abe, Y. Yokoyama, Koki Ochi, Ryuichiro Hanada, S. Izuo
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Abstract

The formation process of fatigue crack networks in Sn-Ag-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.
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Sn-Ag-Cu模具连接接头疲劳裂纹网络的有限元再现分析
实验观察了Sn-Ag-Cu模具连接接头疲劳裂纹网络的形成过程,并基于logistic函数描述的裂纹起裂规律和Paris型疲劳裂纹扩展规律进行了有限元分析。
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