{"title":"A TSV-based architecture for AC-DC converters","authors":"K. Salah","doi":"10.1109/IDT.2013.6727096","DOIUrl":null,"url":null,"abstract":"In this paper, a proposed through silicon via (TSV) structure is used to construct AC-DC converters. This structure is analyzed using 3D electromagnetic full-wave simulators. The results show that the proposed 3D converter exhibits small area with superior performance compared to a 2D transformer, for the same footprint as lossy substrate effects are neglected for low frequency range of interest for DC converters.","PeriodicalId":446826,"journal":{"name":"2013 8th IEEE Design and Test Symposium","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 8th IEEE Design and Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IDT.2013.6727096","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In this paper, a proposed through silicon via (TSV) structure is used to construct AC-DC converters. This structure is analyzed using 3D electromagnetic full-wave simulators. The results show that the proposed 3D converter exhibits small area with superior performance compared to a 2D transformer, for the same footprint as lossy substrate effects are neglected for low frequency range of interest for DC converters.
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