Localised Catalyst Printing for Flexible Conductive Lines by Electroless Copper Deposition on Textiles

Abstract

The formation of flexible conductive structures is essential for the manufacturing of flexible electronic devices. On textile substrates, the formation of defined conductive structures is still a challenge. In this work, we have developed a novel method for silver precursor seeding with subsequent electroless copper deposition (ECD) to overcome this issue. The technique is based on the addition of silver nitrate to citrate impregnated fabrics, leading to a surficial fixation via precipitation and thermal decomposition. Silver nitrate solution printing allowed conductive lines of 2-3 mm with electrical resistances below 1 Ωcm-1. In situ resistance recording revealed the course of percolation establishment and percolation removal for chemical ageing.