Benchmarking of monolithic 3D integrated MX2 FETs with Si FinFETs

T. Agarwal, Á. Szabó, M. Bardon, B. Sorée, I. Radu, P. Raghavan, M. Luisier, W. Dehaene, M. Heyns
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引用次数: 9

Abstract

In this paper, monolayer transition metal dichalcogenide (MX2) FETs are benchmarked with Si FinFET using energy-delay as figure-of-merits and a physical compact model. The model is validated with the help of both atomistic simulations and experimental data for different materials, without the use of any fitting parameter. Single-gate (SG) and double-gate (DG) MX2 FETs are compared from ON current, device capacitance and energy-delay perspective. DG MX2 FETs perform 25–30% faster than SG MX2 FETs for the same energy consumption in case of dominating wire load. WS2 DG FET shows both better energy and speed among chosen MX2 materials. However, in comparison to FinFET, WS2 DG FETs are shown to be ∼ 35% slower, but more energy efficient. Therefore, to match FinFET's performance with MX2 FETs, monolithic 3D integrated MX2 SG and DG FETs are explored. It is shown that 3–5 stacked WS2 DG FETs are needed to meet N3 FinFET performance.
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单片3D集成MX2 fet与Si finfet的基准测试
在本文中,单层过渡金属二硫化物(MX2) fet以Si FinFET为基准,使用能量延迟作为优点图和物理紧凑模型。在不使用任何拟合参数的情况下,利用不同材料的原子模拟和实验数据对模型进行了验证。从导通电流、器件电容和能量延迟的角度对单门(SG)和双门(DG) MX2场效应管进行了比较。在主导线负载情况下,DG MX2 fet在相同能耗下的性能比SG MX2 fet快25-30%。在选择的MX2材料中,WS2 DG FET表现出更好的能量和速度。然而,与FinFET相比,WS2 DG fet的速度要慢约35%,但能效更高。因此,为了使FinFET的性能与MX2 fet相匹配,我们探索了单片3D集成MX2 SG和DG fet。结果表明,为了满足N3 FinFET的性能,需要3-5个堆叠的WS2 DG fet。
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