Simulation study on NMOS gate length variation using TCAD tool

R. Sanudin, M. S. Sulong, M. Morsin, M. Wahab
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引用次数: 2

Abstract

The process of scaling in silicon transistor has consistently resulted in smaller device geometry, higher device density and better performance. In conventional MOSFETs, control of Ioff for scaled devices requires very thin gate dielectrics and high doping concentrations. The industry roadmap predicts the barriers of continuous scaling will be due to physical limitations as well as practical technology. As the downscale of CMOS technology approaches physical limitations, the need arises for alternative device structures. Thus, this paper intends to study the effect of various gate lengths on the NMOS electrical characteristic by means of simulation study.
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基于TCAD的NMOS栅极长度变化仿真研究
硅晶体管的缩放过程一直导致更小的器件几何形状,更高的器件密度和更好的性能。在传统的mosfet中,对缩放器件的关断控制需要非常薄的栅极介电体和高掺杂浓度。行业路线图预测,持续扩展的障碍将来自物理限制和实用技术。随着CMOS技术的小型化接近物理极限,需要替代器件结构。因此,本文拟通过仿真研究的方法来研究不同栅极长度对NMOS电学特性的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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