{"title":"Two and three-dimensional modeling of VSPA butt solder joints","authors":"R. Murphy, S. Sitaraman","doi":"10.1109/ECTC.1997.606211","DOIUrl":null,"url":null,"abstract":"The objective of this work is to develop two- and three-dimensional numerical models of VSPA, a new peripheral array package, and study its solder joint reliability. VSPA has multiple rows of butt-type leads around its periphery and is surface mounted on a standard FR-4 printed circuit board. The FR-4 and various package materials were modeled as temperature-dependent and elastic while the eutectic solder was modeled as temperature-dependent, elastic-plastic. The package and board assembly were subjected to a temperature increase (/spl Delta/T) of 85/spl deg/C with the assumption that the assembly is stress-free at room temperature. The results obtained from a three-dimensional 1/8th section model are compared with the results from 2-D plane-strain and plane-stress models and with 3-D \"strip\" models.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606211","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The objective of this work is to develop two- and three-dimensional numerical models of VSPA, a new peripheral array package, and study its solder joint reliability. VSPA has multiple rows of butt-type leads around its periphery and is surface mounted on a standard FR-4 printed circuit board. The FR-4 and various package materials were modeled as temperature-dependent and elastic while the eutectic solder was modeled as temperature-dependent, elastic-plastic. The package and board assembly were subjected to a temperature increase (/spl Delta/T) of 85/spl deg/C with the assumption that the assembly is stress-free at room temperature. The results obtained from a three-dimensional 1/8th section model are compared with the results from 2-D plane-strain and plane-stress models and with 3-D "strip" models.
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