Atomistic investigation of the electronic structure, thermal properties and conduction defects in Ge-rich GexSe1−x materials for selector applications

S. Clima, B. Govoreanu, K. Opsomer, A. Velea, N. S. Avasarala, W. Devulder, I. Shlyakhov, G. Donadio, T. Witters, S. Kundu, L. Goux, V. Afanasiev, G. Kar, G. Pourtois
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引用次数: 17

Abstract

We investigate the electronic structure and defects of GexSe1−x materials at the atomic level, using full-layer-thickness (5nm) amorphous models. In Ge-rich GexSe1−x, the nature of the mobility gap defects is mostly related to miscoordinated Ge. The population/localization of mobility-gap states changes solely under the effect of electric field. Strong covalent bonds introduced by N doping in the material increase its thermal conductivity and crystallization temperature beyond 600C. C/N dopants are found to add/remove mobility-gap states in the doped systems. Our investigation sets guidelines for material design in view of improved electro-thermal device performance.
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富锗GexSe1−x材料的电子结构、热性能和传导缺陷的原子研究
我们使用全层厚度(5nm)非晶模型在原子水平上研究了GexSe1−x材料的电子结构和缺陷。在富含Ge的GexSe1−x中,迁移空位缺陷的性质主要与Ge失配有关。迁移间隙态的居群/局域化仅在电场作用下发生变化。材料中N掺杂引入的强共价键提高了材料的导热性,结晶温度超过600℃。发现C/N掺杂剂可以增加/消除掺杂体系中的迁移率间隙态。我们的研究为材料设计提供了指导方针,以提高电热器件的性能。
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