J.I. Choi, Li Wang, Xiaolong Wang, D. Hass, J. Magera, R.T. Chen
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引用次数: 5
Abstract
We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 /spl mu/m) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.
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