Development of the amorphous, high resistivity Ge:(O,N) films for radiation-hardened MIS device applications

D. Jishiashvili, Z. Shiolashvili, R. Janelidze, V. Gobronidze, E. Kutelia, L. Mosidze, I. Nakhutsrishvili, M. Katsiashvili
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Abstract

Application of amorphous, high resistivity O- and N-doped Ge films is proposed to solve some radiation hardness problems. The new type of insulating a-Ge:(O,N) films makes it possible to increase the radiation hardness of metal-insulator-semiconductor (MIS) transistors at least by 4 orders of magnitude. Fabrication of MIS integrated circuits on the basis of a-Ge:(O,N) films can enlarge the utilization of these advantageous devices in radioactive environment (space, nuclear power-plants etc.).
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非晶、高电阻率Ge:(O,N)薄膜在辐射硬化MIS器件中的应用
提出应用非晶、高电阻率掺氧和掺氮锗薄膜来解决辐射硬度问题。新型绝缘a-Ge:(O,N)薄膜使金属-绝缘体-半导体(MIS)晶体管的辐射硬度至少提高了4个数量级。基于a-Ge (O,N)薄膜制备MIS集成电路可以扩大这些优势器件在放射性环境(太空、核电站等)中的利用。
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