{"title":"Manufacturability of capacitively coupled multichip modules","authors":"T. Knight, D. Salzman","doi":"10.1109/ECTC.1994.367613","DOIUrl":null,"url":null,"abstract":"Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367613","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Capacitive coupling of off-chip interconnects offers a number of advantages, including low manufacturing and repair costs, dense form factors, low power, high speed, extremely high junction pitch, and easy testing. In this paper, we review and compare the practicalities of conductive and capacitive coupling, and discuss novel issues of manufacturability and materials optimization for capacitively coupled electronic packages.<>
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