{"title":"Silicon angular resonance gyroscope by deep ICPRIE and XeF/sub 2/ gas etching","authors":"Jae-Joon Choi, R. Toda, K. Minami, M. Esashi","doi":"10.1109/MEMSYS.1998.659776","DOIUrl":null,"url":null,"abstract":"An angular resonance silicon gyroscope was fabricated by deep RIE and XeF/sub 2/ gas etching. Using these two etching methods, a sensor which has beams in the center of the thickness of its mass could be fabricated very precisely. The sensor has a glass-silicon-glass structure and its resonator is excited electrostatically and the vibration caused by the angular rate is measured capacitively. Sensor sensitivity obtained was 2.1 fF/(deg/sec).","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1998.659776","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

An angular resonance silicon gyroscope was fabricated by deep RIE and XeF/sub 2/ gas etching. Using these two etching methods, a sensor which has beams in the center of the thickness of its mass could be fabricated very precisely. The sensor has a glass-silicon-glass structure and its resonator is excited electrostatically and the vibration caused by the angular rate is measured capacitively. Sensor sensitivity obtained was 2.1 fF/(deg/sec).
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
硅角共振陀螺仪采用深ICPRIE和XeF/sub / 2/气体刻蚀
采用深度RIE和XeF/sub / gas刻蚀法制备了角共振硅陀螺仪。利用这两种蚀刻方法,可以非常精确地制造出在其质量厚度中心有光束的传感器。该传感器采用玻璃-硅-玻璃结构,谐振腔采用静电激励,由角速度引起的振动采用电容测量。获得的传感器灵敏度为2.1 fF/(度/秒)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Micro force sensor for intravascular neurosurgery and in vivo experiment Laser display technology A silicon IR-source and CO/sub 2/-chamber for CO/sub 2/ measurements Design and fabrication of a novel integrated floating-electrode-"electret"-microphone (FFEM) Microfabrication and parallel operation of 5/spl times/5 2D AFM cantilever arrays for data storage and imaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1