M. Maeda, M. Nishijima, H. Takehara, C. Adachi, H. Fujimoto, Y. Ota, O. Ishikawa
{"title":"A 3.5V, 1.3W GaAs power multichip IC for cellular phone","authors":"M. Maeda, M. Nishijima, H. Takehara, C. Adachi, H. Fujimoto, Y. Ota, O. Ishikawa","doi":"10.1109/GAAS.1993.394501","DOIUrl":null,"url":null,"abstract":"A GaAs power multichip IC (MCIC) operating at 3.5 V for cellular phone has been developed. The MCIC can deliver an output power over 1.3 W with a power-added efficiency of 60% from 890 to 950 MHz. It is comprised of two GaAs MESFETs, three GaAs passive matching chips and a printed board on which biasing networks are fabricated. These components are mounted on an aluminum nitride (AlN) package. The volume of the MCIC is only 0.4 cc, half that of conventional power hybrid ICs. This MCIC will contribute to realization of high performance and very compact cellular phones.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th Annual GaAs IC Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1993.394501","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 22
Abstract
A GaAs power multichip IC (MCIC) operating at 3.5 V for cellular phone has been developed. The MCIC can deliver an output power over 1.3 W with a power-added efficiency of 60% from 890 to 950 MHz. It is comprised of two GaAs MESFETs, three GaAs passive matching chips and a printed board on which biasing networks are fabricated. These components are mounted on an aluminum nitride (AlN) package. The volume of the MCIC is only 0.4 cc, half that of conventional power hybrid ICs. This MCIC will contribute to realization of high performance and very compact cellular phones.<>