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15th Annual GaAs IC Symposium最新文献

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A novel high-speed low-power tri-state driver flip flop (TD-FF) for ultra-low supply voltage GaAs heterojunction FET LSIs 一种用于超低电源电压GaAs异质结场效应晶体管的新型高速低功耗三态驱动触发器(TD-FF)
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394496
T. Maeda, K. Numata, M. Tokushima, M. Ishikawa, M. Fukaishi, H. Hida, Y. Ohno
The authors describe a new GaAs static flip flop, called TD-FF (tri-state driver flip flop), for ultra-low supply voltage GaAs heterojunction FET LSIs. The TD-FF operates at a data rate of 10 Gbps with 18 mW power consumption at 0.8 V supply voltage. The 10 Gbps power consumption is 1/5 of the minimum value reported for D-FFs so far. The authors also demonstrate a 1/8 static frequency divider IC using the TD-FF configuration. This IC operates up to 10 GHz with 38 mW at 0.8 V supply voltage.<>
作者描述了一种新的GaAs静态触发器,称为TD-FF(三态驱动触发器),用于超低电源电压GaAs异质结FET lsi。TD-FF在0.8 V供电电压下的数据速率为10 Gbps,功耗为18 mW。10gbps的功耗是迄今为止报道的d - ff最小值的1/5。作者还演示了使用TD-FF配置的1/8静态分频器IC。该IC在0.8 V电源电压下工作高达10 GHz, 38 mW。
{"title":"A novel high-speed low-power tri-state driver flip flop (TD-FF) for ultra-low supply voltage GaAs heterojunction FET LSIs","authors":"T. Maeda, K. Numata, M. Tokushima, M. Ishikawa, M. Fukaishi, H. Hida, Y. Ohno","doi":"10.1109/GAAS.1993.394496","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394496","url":null,"abstract":"The authors describe a new GaAs static flip flop, called TD-FF (tri-state driver flip flop), for ultra-low supply voltage GaAs heterojunction FET LSIs. The TD-FF operates at a data rate of 10 Gbps with 18 mW power consumption at 0.8 V supply voltage. The 10 Gbps power consumption is 1/5 of the minimum value reported for D-FFs so far. The authors also demonstrate a 1/8 static frequency divider IC using the TD-FF configuration. This IC operates up to 10 GHz with 38 mW at 0.8 V supply voltage.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123123612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
GaAs IC reliability, the next generation GaAs集成电路可靠性,下一代
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394491
W. Roesch
Improvements in semiconductor reliability are constantly being expected and so far, they have been achieved. A historical perspective is presented which provides evidence regarding changes in the way people think about reliability, for GaAs MESFET integrated circuits, in particular. Comparisons to silicon reliability history, and between old and new philosophies are made. Although not intended as a panacea, the direction towards measuring, analyzing, and controlling the variability of all input parameters to reliability is discussed as the key to reaching the next generation.<>
人们一直期待半导体可靠性的提高,到目前为止,它们已经实现了。从历史的角度来看,它提供了关于人们思考可靠性的方式的变化的证据,特别是对于GaAs MESFET集成电路。比较硅的可靠性历史,并在新旧哲学之间。虽然不是万能药,但测量、分析和控制所有输入参数对可靠性的可变性的方向是讨论达到下一代的关键。
{"title":"GaAs IC reliability, the next generation","authors":"W. Roesch","doi":"10.1109/GAAS.1993.394491","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394491","url":null,"abstract":"Improvements in semiconductor reliability are constantly being expected and so far, they have been achieved. A historical perspective is presented which provides evidence regarding changes in the way people think about reliability, for GaAs MESFET integrated circuits, in particular. Comparisons to silicon reliability history, and between old and new philosophies are made. Although not intended as a panacea, the direction towards measuring, analyzing, and controlling the variability of all input parameters to reliability is discussed as the key to reaching the next generation.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124938309","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Process, performance, and reliability characterization of a GaAs VLSI technology GaAs VLSI技术的工艺、性能和可靠性表征
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394490
W. Yamada, K. Macwilliams, S. Brown, N. Zamani, B. Blaes, M. Buehler
The authors present the results from a study of a commercial digital GaAs foundry and attempt to establish a methodology to characterize the process, performance, and reliability of that foundry's technology. A variety of increasingly complex test structures were designed to characterize the digital GaAs process. These structures include the elemental test structures for interconnects, contacts, junctions and devices to increasingly complex gates, latches, simple circuits and gate arrays. The increasing complexity in test structures insures that the results obtained are consistent and accurate. A novel timing circuit called a matrix delay chain is one of the key structures used to characterize the technology. This test structure is intended to allow the direct measurement of inverter propagation delay and as a monitor of performance variations. These variations are due to (1) process nonuniformities, (2) power supply fluctuations, (3) temperature extremes, (4) reliability degradations and, for use in space, and (5) radiation degradations. The collection of test structures was fabricated in an enhancement-depletion mode process utilizing 0.8 /spl mu/m gate length, and three level aluminum based metallization.<>
作者介绍了对商业数字GaAs铸造厂的研究结果,并试图建立一种方法来表征该铸造厂技术的过程、性能和可靠性。设计了各种日益复杂的测试结构来表征数字砷化镓工艺。这些结构包括互连、触点、结和器件的基本测试结构,以日益复杂的门、锁存器、简单电路和门阵列。越来越复杂的测试结构保证了测试结果的一致性和准确性。一种称为矩阵延迟链的新型定时电路是表征该技术的关键结构之一。这种测试结构的目的是允许直接测量逆变器的传播延迟,并作为性能变化的监测。这些变化是由于(1)工艺不均匀性,(2)电源波动,(3)极端温度,(4)可靠性下降(用于空间)和(5)辐射退化。测试结构采用增强-耗尽模式工艺,栅极长度为0.8 /spl mu/m,铝基金属化为三层
{"title":"Process, performance, and reliability characterization of a GaAs VLSI technology","authors":"W. Yamada, K. Macwilliams, S. Brown, N. Zamani, B. Blaes, M. Buehler","doi":"10.1109/GAAS.1993.394490","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394490","url":null,"abstract":"The authors present the results from a study of a commercial digital GaAs foundry and attempt to establish a methodology to characterize the process, performance, and reliability of that foundry's technology. A variety of increasingly complex test structures were designed to characterize the digital GaAs process. These structures include the elemental test structures for interconnects, contacts, junctions and devices to increasingly complex gates, latches, simple circuits and gate arrays. The increasing complexity in test structures insures that the results obtained are consistent and accurate. A novel timing circuit called a matrix delay chain is one of the key structures used to characterize the technology. This test structure is intended to allow the direct measurement of inverter propagation delay and as a monitor of performance variations. These variations are due to (1) process nonuniformities, (2) power supply fluctuations, (3) temperature extremes, (4) reliability degradations and, for use in space, and (5) radiation degradations. The collection of test structures was fabricated in an enhancement-depletion mode process utilizing 0.8 /spl mu/m gate length, and three level aluminum based metallization.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126036630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The use of compilers for digital GaAs IC design 利用编译器进行数字GaAs集成电路的设计
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394499
R. Oettel
The ultimate performance of an integrated circuit can be substantially improved by using a compiler-based tool for its design. This is particularly true for gallium arsenide circuits where speed performance is critical, the cost of real estate is high, and design expertise is scarce. Furthermore, now that high levels of integration are possible with GaAs, automated layout tools are needed to manage the complexity and simultaneously preserve the performance potential of the technology. The result of applying compiler methodology to several generations of gallium arsenide technology over an eight year period is reported.<>
通过使用基于编译器的设计工具,集成电路的最终性能可以大大提高。对于速度性能至关重要的砷化镓电路来说尤其如此,房地产成本高,设计专业知识稀缺。此外,既然GaAs可以实现高水平的集成,就需要自动化布局工具来管理复杂性,同时保持技术的性能潜力。本文报道了在八年间将编译方法应用于几代砷化镓技术的结果。
{"title":"The use of compilers for digital GaAs IC design","authors":"R. Oettel","doi":"10.1109/GAAS.1993.394499","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394499","url":null,"abstract":"The ultimate performance of an integrated circuit can be substantially improved by using a compiler-based tool for its design. This is particularly true for gallium arsenide circuits where speed performance is critical, the cost of real estate is high, and design expertise is scarce. Furthermore, now that high levels of integration are possible with GaAs, automated layout tools are needed to manage the complexity and simultaneously preserve the performance potential of the technology. The result of applying compiler methodology to several generations of gallium arsenide technology over an eight year period is reported.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123710107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A monolithic multifunction EW broadband receiver converter 单片多功能电子战宽带接收转换器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394468
W. Brinlee, A. Pavio, C. Goldsmith, W. Thompson
A unique multifunction receiver converter chip, consisting of RF amplifiers, switches, a lumped-element filter, and a double-balanced mixer, has been developed. The chip design employs various circuit design refinements, such as amplifier feedback techniques to enhance stability and repeatability, FET switches to reduce power consumption, and a lumped-element filter to reduce size. The double-balanced mixer topology eliminates IF extraction problems and combines the best performance characteristics of active and passive baluns while employing diode mixing elements.<>
研制了一种独特的多功能接收机转换芯片,该芯片由射频放大器、开关、集总元滤波器和双平衡混频器组成。芯片设计采用了各种电路设计改进,例如放大器反馈技术以提高稳定性和可重复性,FET开关以降低功耗,以及集总元滤波器以减小尺寸。双平衡混合器拓扑结构消除了中频提取问题,并结合了有源和无源平衡器的最佳性能特征,同时采用二极管混合元件。
{"title":"A monolithic multifunction EW broadband receiver converter","authors":"W. Brinlee, A. Pavio, C. Goldsmith, W. Thompson","doi":"10.1109/GAAS.1993.394468","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394468","url":null,"abstract":"A unique multifunction receiver converter chip, consisting of RF amplifiers, switches, a lumped-element filter, and a double-balanced mixer, has been developed. The chip design employs various circuit design refinements, such as amplifier feedback techniques to enhance stability and repeatability, FET switches to reduce power consumption, and a lumped-element filter to reduce size. The double-balanced mixer topology eliminates IF extraction problems and combines the best performance characteristics of active and passive baluns while employing diode mixing elements.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125289661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A monolithic 1/spl times/2 W-band four-stage low noise amplifier array [for antennas and FPA] 单片1/spl倍/2 w波段四级低噪声放大器阵列[用于天线和FPA]
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394451
D. Lo, G. Dow, S. Chen, H. Wang, T. Ton, K. Tan, B. Allen
The authors report a monolithic 1/spl times/2 W-band four-stage low noise amplifier array based on 0.1 /spl mu/m PM Al/sub 0.25/Ga/sub 0.75/As/In/sub 0.22/Ga/sub 0.78/As/GaAs HEMT technology for applications in W-band phased array antennas or focal plane imaging array. The amplifiers have achieved an average gain of 19 dB over the band from 77 to 100 GHz and a noise figure of 5-6 dB from 92 to 96 GHz. Crosstalk between the amplifiers in the 1/spl times/2 array is less than -25 dB from 80 to 100 GHz. Successful demonstration of this high level integrated MMIC indicates the maturity of 0.1 /spl mu/m GaAs-based HEMT technology and the feasiblity of high density monolithic integration of array or multifunction chips for future low cost and compact millimeter wave systems.<>
本文报道了一种基于0.1 /spl μ m PM Al/sub 0.25/Ga/sub 0.75/As/In/sub 0.22/Ga/sub 0.78/As/GaAs HEMT技术的单片1/spl倍/2 w波段4级低噪声放大器阵列,可应用于w波段相控阵天线或焦平面成像阵列。该放大器在77至100 GHz频段内的平均增益为19 dB,在92至96 GHz频段内的噪声系数为5-6 dB。在80到100 GHz范围内,1/spl times/2阵列放大器之间的串扰小于-25 dB。这种高水平集成MMIC的成功演示表明了0.1 /spl mu/m gaas基HEMT技术的成熟,以及为未来低成本和紧凑的毫米波系统提供阵列或多功能芯片高密度单片集成的可行性。
{"title":"A monolithic 1/spl times/2 W-band four-stage low noise amplifier array [for antennas and FPA]","authors":"D. Lo, G. Dow, S. Chen, H. Wang, T. Ton, K. Tan, B. Allen","doi":"10.1109/GAAS.1993.394451","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394451","url":null,"abstract":"The authors report a monolithic 1/spl times/2 W-band four-stage low noise amplifier array based on 0.1 /spl mu/m PM Al/sub 0.25/Ga/sub 0.75/As/In/sub 0.22/Ga/sub 0.78/As/GaAs HEMT technology for applications in W-band phased array antennas or focal plane imaging array. The amplifiers have achieved an average gain of 19 dB over the band from 77 to 100 GHz and a noise figure of 5-6 dB from 92 to 96 GHz. Crosstalk between the amplifiers in the 1/spl times/2 array is less than -25 dB from 80 to 100 GHz. Successful demonstration of this high level integrated MMIC indicates the maturity of 0.1 /spl mu/m GaAs-based HEMT technology and the feasiblity of high density monolithic integration of array or multifunction chips for future low cost and compact millimeter wave systems.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125682478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
GaAs on InP MESFETs and circuits for OEICs InP mesfet上的GaAs和oeic电路
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394469
A. Clei, S. Sainson, M. Feuillade, K. Sauv, R. Azoulay, J. Dumas, M. Chertouk, O. Calliger, R. Lefevre
High performance FETs and circuits realized on GaAs layers heteroepitaxially grown on InP are described. Low parasitic effects are ascertained by noise and pulse measurements indicating a low electrical activity of the defects related to the lattice mismatch. 0.3 /spl mu/m gatelength laser drivers show satisfactory behavior at 10 Gbit/s. Device degradation observed after accelerated aging tests results from contact degradation rather than from mismatched materials problems. GaAs on InP FETs appear to be good candidates for 1.3-1.55 /spl mu/m OEICs.<>
描述了在InP上异质外延生长的GaAs层上实现的高性能场效应管和电路。通过噪声和脉冲测量确定了低寄生效应,表明与晶格失配相关的缺陷的低电活动。0.3 /spl mu/m栅极长度激光驱动器在10gbit /s速率下表现出满意的性能。加速老化试验后观察到的器件退化是由于接触退化,而不是由于材料不匹配问题。InP fet上的GaAs似乎是1.3-1.55 /spl mu/m oeic的良好候选者
{"title":"GaAs on InP MESFETs and circuits for OEICs","authors":"A. Clei, S. Sainson, M. Feuillade, K. Sauv, R. Azoulay, J. Dumas, M. Chertouk, O. Calliger, R. Lefevre","doi":"10.1109/GAAS.1993.394469","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394469","url":null,"abstract":"High performance FETs and circuits realized on GaAs layers heteroepitaxially grown on InP are described. Low parasitic effects are ascertained by noise and pulse measurements indicating a low electrical activity of the defects related to the lattice mismatch. 0.3 /spl mu/m gatelength laser drivers show satisfactory behavior at 10 Gbit/s. Device degradation observed after accelerated aging tests results from contact degradation rather than from mismatched materials problems. GaAs on InP FETs appear to be good candidates for 1.3-1.55 /spl mu/m OEICs.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115353008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Unique determination of AlGaAs/GaAs HBT's small-signal equivalent circuit parameters 独特测定 AlGaAs/GaAs HBT 的小信号等效电路参数
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394456
Der-woei Wu, D.L. Miller, M. Fukuda, Y. Yun
A new parameter extraction technique for heterojunction bipolar transistors (HBTs) is described. Utilizing a novel low frequency extraction algorithm, the intrinsic elements and the resistive parasitics are obtained. The overall small-signal equivalent circuit of HBTs is then determined based on those extracted element values. This technique advances current equivalent circuit modeling capability of HBTs by minimizing the interactive computer optimization/simulation process and removing the need of special test structures.<>
本文介绍了一种用于异质结双极晶体管(HBT)的新参数提取技术。利用新颖的低频提取算法,可以获得本征元件和电阻寄生。然后根据这些提取的元件值确定 HBT 的整体小信号等效电路。这项技术最大程度地减少了交互式计算机优化/模拟过程,并消除了对特殊测试结构的需求,从而提高了当前 HBT 的等效电路建模能力。
{"title":"Unique determination of AlGaAs/GaAs HBT's small-signal equivalent circuit parameters","authors":"Der-woei Wu, D.L. Miller, M. Fukuda, Y. Yun","doi":"10.1109/GAAS.1993.394456","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394456","url":null,"abstract":"A new parameter extraction technique for heterojunction bipolar transistors (HBTs) is described. Utilizing a novel low frequency extraction algorithm, the intrinsic elements and the resistive parasitics are obtained. The overall small-signal equivalent circuit of HBTs is then determined based on those extracted element values. This technique advances current equivalent circuit modeling capability of HBTs by minimizing the interactive computer optimization/simulation process and removing the need of special test structures.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129189637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
An integrated GaAs 1.25 GHz clock frequency FM-CW direct digital synthesizer 一种集成的GaAs 1.25 GHz时钟频率FM-CW直接数字合成器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394477
N. Caglio, J. Degouy, D. Meignant, P. Rousseau, B. Leroux
An integrated GaAs FM-CW direct digital synthesizer (DDS) has been developed using Philips Microwave Limeil (PML) standard ER07AD technology. The DDS is composed of two successive functional blocks: a double phase accumulator which produces the right synchronizing sequences and a digital to analog sine converter (DASC) which generates the linear chirp waveform. The double phase accumulator has been implemented with five chips while the DASC is monolithic. The maximum measured clock frequency on the phase accumulator is 1.25 GHz and the power consumption is 320 mW. For the DASC, the maximum measured clock frequency is 1.5 GHz and the associated consumption is 600 mW.<>
采用Philips Microwave Limeil (PML)标准ER07AD技术,开发了集成的GaAs FM-CW直接数字合成器(DDS)。DDS由两个连续的功能模块组成:产生正确同步序列的双相累加器和产生线性啁啾波形的数模正弦转换器(DASC)。双相蓄能器采用5片芯片实现,DASC采用单片芯片。相位蓄能器的最大测量时钟频率为1.25 GHz,功耗为320 mW。对于DASC,最大测量时钟频率为1.5 GHz,相关功耗为600mw .>
{"title":"An integrated GaAs 1.25 GHz clock frequency FM-CW direct digital synthesizer","authors":"N. Caglio, J. Degouy, D. Meignant, P. Rousseau, B. Leroux","doi":"10.1109/GAAS.1993.394477","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394477","url":null,"abstract":"An integrated GaAs FM-CW direct digital synthesizer (DDS) has been developed using Philips Microwave Limeil (PML) standard ER07AD technology. The DDS is composed of two successive functional blocks: a double phase accumulator which produces the right synchronizing sequences and a digital to analog sine converter (DASC) which generates the linear chirp waveform. The double phase accumulator has been implemented with five chips while the DASC is monolithic. The maximum measured clock frequency on the phase accumulator is 1.25 GHz and the power consumption is 320 mW. For the DASC, the maximum measured clock frequency is 1.5 GHz and the associated consumption is 600 mW.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124186509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Manufacturing technology development for high yield pseudomorphic HEMT 高产量伪晶HEMT制造技术发展
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394476
S. Bar, C.S. Wu, Ming Hu, H. Kanber, C. Pao, W. Yau
The authors present an approach to establishing PHEMT manufacturing technology. They discuss the impact of development work in four key process areas. They also demonstrate good wafer uniformity and wafer to wafer reproducibility for PHEMT X-band multifunction LNAs.<>
提出了一种建立PHEMT制造技术的方法。他们讨论了开发工作在四个关键过程域中的影响。它们还显示了PHEMT x波段多功能LNAs的良好晶圆均匀性和晶圆间再现性。
{"title":"Manufacturing technology development for high yield pseudomorphic HEMT","authors":"S. Bar, C.S. Wu, Ming Hu, H. Kanber, C. Pao, W. Yau","doi":"10.1109/GAAS.1993.394476","DOIUrl":"https://doi.org/10.1109/GAAS.1993.394476","url":null,"abstract":"The authors present an approach to establishing PHEMT manufacturing technology. They discuss the impact of development work in four key process areas. They also demonstrate good wafer uniformity and wafer to wafer reproducibility for PHEMT X-band multifunction LNAs.<<ETX>>","PeriodicalId":347339,"journal":{"name":"15th Annual GaAs IC Symposium","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134253948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
期刊
15th Annual GaAs IC Symposium
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