A. Wiatrowska, K. Fiączyk, P. Kowalczewski, M. Łysień, Łukasz Witczak, Jolanta Gadzalińska, Ludovic Schneider, Łukasz Kosior, F. Granek
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引用次数: 0
Abstract
We demonstrate a novel Ultra-Precise Deposition (UPD) technology for heterogeneous integration in advanced packaging and printing interconnections on flexible substrates. UPD allows maskless deposition of highly-concentrated pastes on complex substrates. The printing resolution is in the range from 1 to 10 µm. The ink viscosity is up to 2,500,000 cP, which corresponds to 85% wt. of metal content and the electrical conductivity of printed structures is up to 45% of the bulk value. This technology is designed for rapid prototyping and manufacturing of next-generation printed and flexible electronics devices, including sensors, integrated circuits, displays, and energy harvesting systems.
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