{"title":"A new encapsulating method for semiconductor devices using resin sheets","authors":"H. Ota, S. Fujieda, T. Okuyama","doi":"10.1109/ECTC.1997.606145","DOIUrl":null,"url":null,"abstract":"This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606145","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper describes a new encapsulating method using resin sheets. There are three important points to develop this method. 1. New molding process and encapsulating molds. 2. Resin suitable for this method. 3. Measuring method for resin state. This method is suitable for fabricating thin packages. These thin model packages showed the high reliability of pressure cooker test and thermal cycle test.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
