Efficient electronic cooling via flow-induced vibrations

Abstract

A novel method that exploits flow-induced vibration for enhancing heat transfer in electronic cooling applications is explored using coupled flow-structural-thermal modeling. The idea is inspired from wind-instruments where the flow-induced vibration of a “reed” generates sound. In the current approach, a reed installed in a channel with heated walls is shown to generate vortex structures that enhance thermal convection with low pressure loss. Simulations employ a multiphysics approach to model the dynamics of this coupled flow, structure and thermal problem. Through flow visualizations and analyses, the dominant heat transfer enhancement mechanism is identified. Vortical structures shed from the self-actuated fluttering reed cause jetting of cold fluid from the core of the flow towards the heated top and bottom walls of the channel, causing sharper temperature gradients and thus higher heat flux. This mechanism led to 30% higher heat transfer for a fixed flow rate, and an 11% improvement in the thermal enhancement factor.