Pub Date : 2017-04-13DOI: 10.1109/SEMI-THERM.2017.7896926
Mustafa A. Kadhim, Yaser Al-Anii, N. Kapur, J. Summers, H. Thompson
Datacenter energy consumption constitutes a large portion of global energy consumption. Particularly, a large amount of this energy is consumed by the datacenter cooling system. Subsequently, many innovative cooling technologies have been developed to reduce energy consumption and increase cooling performance. In this work, an experimental setup was designed and constructed which comprises a direct liquid-cooled server, rack-level cooling and compressor-free external cooling system. This study tracks the heat generated from IT processes to the environment. In addition, the power usage effectiveness (PUE) and the air handling unit (AHU) performance are investigated. The objectives were studied under different datacenter operation scenarios, and AHU configurations.
{"title":"Performance of a mixed mode air handling unit for direct liquid-cooled servers","authors":"Mustafa A. Kadhim, Yaser Al-Anii, N. Kapur, J. Summers, H. Thompson","doi":"10.1109/SEMI-THERM.2017.7896926","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896926","url":null,"abstract":"Datacenter energy consumption constitutes a large portion of global energy consumption. Particularly, a large amount of this energy is consumed by the datacenter cooling system. Subsequently, many innovative cooling technologies have been developed to reduce energy consumption and increase cooling performance. In this work, an experimental setup was designed and constructed which comprises a direct liquid-cooled server, rack-level cooling and compressor-free external cooling system. This study tracks the heat generated from IT processes to the environment. In addition, the power usage effectiveness (PUE) and the air handling unit (AHU) performance are investigated. The objectives were studied under different datacenter operation scenarios, and AHU configurations.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"42 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117246495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-04-13DOI: 10.1109/SEMI-THERM.2017.7896915
Morgan Tatchell-Evans, D. Burdett, J. Summers, Adam Beaumont, G. Fox
Aisle containment is increasingly common in data centres, and is widely believed to improve efficiency and effectiveness of cooling. Investigations into the impacts of aisle containment on the behavior and power consumption of cooling infrastructure and servers have been limited. Nor has the impact of supply air conditions on these factors been extensively investigated. This work uses measurements of bypass in a test data centre and observations on server behavior in a wind tunnel, in conjunction with a system model, to investigate the efficiency with which computations can be undertaken in an aisle contained data centre, and how this is impacted by supply air conditions.
{"title":"An experimental and theoretical investigation of the effects of supply air conditions on computational efficiency in data centers employing aisle containment","authors":"Morgan Tatchell-Evans, D. Burdett, J. Summers, Adam Beaumont, G. Fox","doi":"10.1109/SEMI-THERM.2017.7896915","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896915","url":null,"abstract":"Aisle containment is increasingly common in data centres, and is widely believed to improve efficiency and effectiveness of cooling. Investigations into the impacts of aisle containment on the behavior and power consumption of cooling infrastructure and servers have been limited. Nor has the impact of supply air conditions on these factors been extensively investigated. This work uses measurements of bypass in a test data centre and observations on server behavior in a wind tunnel, in conjunction with a system model, to investigate the efficiency with which computations can be undertaken in an aisle contained data centre, and how this is impacted by supply air conditions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114116093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-04-11DOI: 10.1109/SEMI-THERM.2017.7896933
S. Polzer, W. Wilkins, J. Prairie, B. Gilbert, C. Haider
As system performance requirements for high performance computing (HPC) systems become more demanding, the need to increase component packaging density to shorten interconnect distances becomes more stringent. One technique for accomplishing this requirement is to implement 3-dimensional heterogeneous integration of system components. In an earlier publication, we described the design of a processor-memory module for a high performance computing (HPC) application space using a 3D integration (3DI) approach [1]. The design was based on interconnection and power delivery requirements for a processor-memory module capable of supporting 64 full-duplex 30 Gb/second SerDes, routing for 800 processor-to-memory pins, an integrated multi-tiered power delivery network, and a thermal management solution capable of dissipating a nominal processor heat flux of 100 W/cm2. Using thermal test chips (TTC), we designed and assembled a 3D processor-memory module with an integrated power delivery network to investigate interconnect density, integration, testability, and rework issues with 3D integrated packaging in an HPC environment. The technologies selected—semi-rigid flex, power connectors, land grid array (LGA) attachment with an anisotropic film, and cold plate-based cooling—are all commercially available, which were adapted for the test module. We were able to fabricate and conduct thermal testing of this design. This paper includes an overview of our HPC 3DI thermal test vehicle (3DI TTV) design, and compares test results between measured and simulated temperatures for the TTCs used to emulate both the memory and the processor. Unexpected differences were observed between the measured and simulated results at a corner location on the TTC. After ruling out device and test equipment issues, we discovered a silicon defect that, although it could not be modeled using our standard computational fluid dynamics (CFD) methods, appeared to explain the measured results. A rudimentary finite element analysis (FEA) analysis agreed more closely with the measured results, indicating the need for awareness of possible limitations with assumptions used in our CFD analysis.
{"title":"High performance computing (HPC) 3 dimensional integrated (3DI) thermal test vehicle validation effort","authors":"S. Polzer, W. Wilkins, J. Prairie, B. Gilbert, C. Haider","doi":"10.1109/SEMI-THERM.2017.7896933","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896933","url":null,"abstract":"As system performance requirements for high performance computing (HPC) systems become more demanding, the need to increase component packaging density to shorten interconnect distances becomes more stringent. One technique for accomplishing this requirement is to implement 3-dimensional heterogeneous integration of system components. In an earlier publication, we described the design of a processor-memory module for a high performance computing (HPC) application space using a 3D integration (3DI) approach [1]. The design was based on interconnection and power delivery requirements for a processor-memory module capable of supporting 64 full-duplex 30 Gb/second SerDes, routing for 800 processor-to-memory pins, an integrated multi-tiered power delivery network, and a thermal management solution capable of dissipating a nominal processor heat flux of 100 W/cm2. Using thermal test chips (TTC), we designed and assembled a 3D processor-memory module with an integrated power delivery network to investigate interconnect density, integration, testability, and rework issues with 3D integrated packaging in an HPC environment. The technologies selected—semi-rigid flex, power connectors, land grid array (LGA) attachment with an anisotropic film, and cold plate-based cooling—are all commercially available, which were adapted for the test module. We were able to fabricate and conduct thermal testing of this design. This paper includes an overview of our HPC 3DI thermal test vehicle (3DI TTV) design, and compares test results between measured and simulated temperatures for the TTCs used to emulate both the memory and the processor. Unexpected differences were observed between the measured and simulated results at a corner location on the TTC. After ruling out device and test equipment issues, we discovered a silicon defect that, although it could not be modeled using our standard computational fluid dynamics (CFD) methods, appeared to explain the measured results. A rudimentary finite element analysis (FEA) analysis agreed more closely with the measured results, indicating the need for awareness of possible limitations with assumptions used in our CFD analysis.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121084936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-04-11DOI: 10.1109/SEMI-THERM.2017.7896924
M. Sahini, Chinmay Kshirsagar, Mathan Kumar, D. Agonafer, J. Fernandes, Jacob Na, V. Mulay, P. McGinn, Michael Soares
In the wake of ever-growing demand for power and energy across US and worldwide, development of energy efficient solutions has become very important. Considering data center applications, cooling power consumption constitutes significant part of the overall energy usage of the system. In the process of optimizing the energy consumed per performance unit, liquid cooling has become one of the key solutions. In this study, 2OU (OpenU; 1OU = 48mm) web servers are tested in a rack level and the effect of higher inlet temperatures in terms of IT and cooling powers, and internal component temperatures are reported. The study serves as a comparison for two different coolant pumping systems i.e. distributed vs. centralized systems. The cooling set up includes a mini rack capable of housing up to eleven liquid cooled web servers and two heat exchangers that exhaust the heat dissipated from the servers to the environment. Each server is equipped with two cold plates cooling the CPUs while rest of the components are air cooled. The configuration that consists of cold plates with integrated pumps is referred as distributed pumping system. Whereas, the configuration with no integrated pumps at cold plates and only has two pumps placed in series with heat exchanger at the rack is referred as centralized pumping system. To study performance characteristics such as device temperatures and power consumptions of server components, synthetic load has been generated on each server using stress-testing tools. The servers are tested for higher inlet temperatures ranging from 25°C to 45°C which falls within the ASHRAE liquid cooled envelope, W4 [1]. This current work is a follow-up study to the analysis conducted comparing centralized and distributed pumping [2].
{"title":"Rack-level study of hybrid cooled servers using warm water cooling for distributed vs. centralized pumping systems","authors":"M. Sahini, Chinmay Kshirsagar, Mathan Kumar, D. Agonafer, J. Fernandes, Jacob Na, V. Mulay, P. McGinn, Michael Soares","doi":"10.1109/SEMI-THERM.2017.7896924","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896924","url":null,"abstract":"In the wake of ever-growing demand for power and energy across US and worldwide, development of energy efficient solutions has become very important. Considering data center applications, cooling power consumption constitutes significant part of the overall energy usage of the system. In the process of optimizing the energy consumed per performance unit, liquid cooling has become one of the key solutions. In this study, 2OU (OpenU; 1OU = 48mm) web servers are tested in a rack level and the effect of higher inlet temperatures in terms of IT and cooling powers, and internal component temperatures are reported. The study serves as a comparison for two different coolant pumping systems i.e. distributed vs. centralized systems. The cooling set up includes a mini rack capable of housing up to eleven liquid cooled web servers and two heat exchangers that exhaust the heat dissipated from the servers to the environment. Each server is equipped with two cold plates cooling the CPUs while rest of the components are air cooled. The configuration that consists of cold plates with integrated pumps is referred as distributed pumping system. Whereas, the configuration with no integrated pumps at cold plates and only has two pumps placed in series with heat exchanger at the rack is referred as centralized pumping system. To study performance characteristics such as device temperatures and power consumptions of server components, synthetic load has been generated on each server using stress-testing tools. The servers are tested for higher inlet temperatures ranging from 25°C to 45°C which falls within the ASHRAE liquid cooled envelope, W4 [1]. This current work is a follow-up study to the analysis conducted comparing centralized and distributed pumping [2].","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133482945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896947
M. Čermák, J. Kenna, M. Bahrami
Novel staggered plate fin heat sinks made of natural graphite sheets are presented and their performance is demonstrated via a direct comparison with aluminum. Measurements in a simple wind tunnel with a diode acting as a heat source show that the junction-to-ambient thermal resistance of the graphite heat sink is 31% lower when no electrically insulating thermal interface material (TIM) is used due to the lower thermal contact resistance (TCR). This offers a possibility to eliminate thermal grease in applications where electrical insulation is not required. With TIM both graphite and aluminum perform comparably. The graphite heat sink was less than half the weight of the aluminum one.
{"title":"Natural-graphite-sheet based heat sinks","authors":"M. Čermák, J. Kenna, M. Bahrami","doi":"10.1109/SEMI-THERM.2017.7896947","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896947","url":null,"abstract":"Novel staggered plate fin heat sinks made of natural graphite sheets are presented and their performance is demonstrated via a direct comparison with aluminum. Measurements in a simple wind tunnel with a diode acting as a heat source show that the junction-to-ambient thermal resistance of the graphite heat sink is 31% lower when no electrically insulating thermal interface material (TIM) is used due to the lower thermal contact resistance (TCR). This offers a possibility to eliminate thermal grease in applications where electrical insulation is not required. With TIM both graphite and aluminum perform comparably. The graphite heat sink was less than half the weight of the aluminum one.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114350769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896911
Unique Rahangdale, Rahul Srinivas, S. Krishnamurthy, Pavan Rajmane, Abel Misrak, A. Sakib, D. Agonafer, A. Lohia, S. Kummerl, L. Nguyen
QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial application demanding thicker PCB. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power cycling. The die is the only heat source causing non-uniform temperature distribution. The solder joint reliability assessment of Quad Flat no-lead Package (QFN) is done using Finite element analysis (FEA) under two different loads. In this paper, the power cycling and thermal cycling act as a combined load. The reliability assessment is done to check stress distribution on PCB boards and solder joint. The life to failure is determined for QFN package assembly. Also, three different QFN boards were used for analysis and comparison has been done to investigate the impact of thickness and copper content of board on solder joint reliability under power cycling and thermal cycling. The mismatch in coefficient of thermal expansion (CTE) between components used in QFN and the non-uniform temperature distribution makes the package deform. Modeling of life prediction is usually conducted for Accelerated Thermal Cycling (ATC) condition, which assumes uniform temperature throughout the assembly. An assembly is also subjected to Power Cycling i.e. non-uniform temperature with the chip as the only source of heat generation. This work shows the performance of QFN package assembly under thermal and power cycle in combination and the stress distribution and plastic work for the package. The layered model analysis was done to investigate the impact of the FR4 layer and copper content in the PCB on the solder joint reliability. The comparative study between lumped and layered model has also done under power cycling and thermal cycling.
{"title":"Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling","authors":"Unique Rahangdale, Rahul Srinivas, S. Krishnamurthy, Pavan Rajmane, Abel Misrak, A. Sakib, D. Agonafer, A. Lohia, S. Kummerl, L. Nguyen","doi":"10.1109/SEMI-THERM.2017.7896911","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896911","url":null,"abstract":"QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial application demanding thicker PCB. When an electronic device is turned off and then turned on multiple times, it creates a loading condition called power cycling. The die is the only heat source causing non-uniform temperature distribution. The solder joint reliability assessment of Quad Flat no-lead Package (QFN) is done using Finite element analysis (FEA) under two different loads. In this paper, the power cycling and thermal cycling act as a combined load. The reliability assessment is done to check stress distribution on PCB boards and solder joint. The life to failure is determined for QFN package assembly. Also, three different QFN boards were used for analysis and comparison has been done to investigate the impact of thickness and copper content of board on solder joint reliability under power cycling and thermal cycling. The mismatch in coefficient of thermal expansion (CTE) between components used in QFN and the non-uniform temperature distribution makes the package deform. Modeling of life prediction is usually conducted for Accelerated Thermal Cycling (ATC) condition, which assumes uniform temperature throughout the assembly. An assembly is also subjected to Power Cycling i.e. non-uniform temperature with the chip as the only source of heat generation. This work shows the performance of QFN package assembly under thermal and power cycle in combination and the stress distribution and plastic work for the package. The layered model analysis was done to investigate the impact of the FR4 layer and copper content in the PCB on the solder joint reliability. The comparative study between lumped and layered model has also done under power cycling and thermal cycling.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129364489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896917
T. Wilde, M. Ott, A. Auweter, I. Meijer, P. Ruch, Markus Hilger, Steffen Kühnert, Herbert Huber
In High Performance Computing (HPC), chiller-less cooling has replaced mechanical chiller supported cooling for a significant part of the HPC system resulting in lower cooling costs. Still, other IT components and IT systems remain that require air or cold water cooling. This work introduces CooLMUC-2, a high-temperature direct-liquid cooled (HT-DLC) HPC system which uses a heat-recovery scheme to drive an adsorption refrigeration process. Using an adsorption chiller is at least two times more efficient than a mechanical chiller for producing needed cold water. To this date this is the only installation of adsorption chillers in a data center combining a Top500 production level HPC system with adsorption refrigeration. This prototype installation is one more step towards a 100% mechanical chiller-free data center. After optimization of the operational parameters of the system, the adsorption chillers of CooLMUC-2 consume just over 6kW of electrical power to not only remove 95kW of heat from the supercomputer, but also to produce more than 50kW of cold water. This paper presents initial measurements characterizing the heat-recovery performance of CooLMUC-2 at different operating conditions.
{"title":"CooLMUC-2: A supercomputing cluster with heat recovery for adsorption cooling","authors":"T. Wilde, M. Ott, A. Auweter, I. Meijer, P. Ruch, Markus Hilger, Steffen Kühnert, Herbert Huber","doi":"10.1109/SEMI-THERM.2017.7896917","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896917","url":null,"abstract":"In High Performance Computing (HPC), chiller-less cooling has replaced mechanical chiller supported cooling for a significant part of the HPC system resulting in lower cooling costs. Still, other IT components and IT systems remain that require air or cold water cooling. This work introduces CooLMUC-2, a high-temperature direct-liquid cooled (HT-DLC) HPC system which uses a heat-recovery scheme to drive an adsorption refrigeration process. Using an adsorption chiller is at least two times more efficient than a mechanical chiller for producing needed cold water. To this date this is the only installation of adsorption chillers in a data center combining a Top500 production level HPC system with adsorption refrigeration. This prototype installation is one more step towards a 100% mechanical chiller-free data center. After optimization of the operational parameters of the system, the adsorption chillers of CooLMUC-2 consume just over 6kW of electrical power to not only remove 95kW of heat from the supercomputer, but also to produce more than 50kW of cold water. This paper presents initial measurements characterizing the heat-recovery performance of CooLMUC-2 at different operating conditions.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130213761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896904
R. Bornoff, A. Vass-Várnai, B. Blackmore, Gang Wang, V. H. Wong
Classical approaches to the 3D thermal simulation of electronic systems require assumptions regarding the amount of power dissipated and its distribution. Errors in such assumptions are a leading cause of resulting errors in temperature rise predictions. Although 3D electro-thermal simulations can be applied; where electrical boundary conditions are specified and current density, electrical potential and Joule heating fields predicted, such approaches are often limited to linear IV assumptions and so are not directly applicable to semiconductor materials within the electrical circuit. This paper introduces an electro-thermal calibration methodology where the effective electrical resistance of the active semiconductor layer of an IGBT chip is determined at a given driving current via comparisons to experimental measurement. The resulting full-circuit electro-thermal simulation predicts power dissipation and temperature variation throughout an entire Power Invertor module. Insights are provided into the power dissipation budget within the system, power and temperature variations within the IGBT chips which are explained with aid of an analysis of the current variation within each bond wire.
{"title":"Full-circuit 3D electro-thermal modeling of an IGBT Power Inverter","authors":"R. Bornoff, A. Vass-Várnai, B. Blackmore, Gang Wang, V. H. Wong","doi":"10.1109/SEMI-THERM.2017.7896904","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896904","url":null,"abstract":"Classical approaches to the 3D thermal simulation of electronic systems require assumptions regarding the amount of power dissipated and its distribution. Errors in such assumptions are a leading cause of resulting errors in temperature rise predictions. Although 3D electro-thermal simulations can be applied; where electrical boundary conditions are specified and current density, electrical potential and Joule heating fields predicted, such approaches are often limited to linear IV assumptions and so are not directly applicable to semiconductor materials within the electrical circuit. This paper introduces an electro-thermal calibration methodology where the effective electrical resistance of the active semiconductor layer of an IGBT chip is determined at a given driving current via comparisons to experimental measurement. The resulting full-circuit electro-thermal simulation predicts power dissipation and temperature variation throughout an entire Power Invertor module. Insights are provided into the power dissipation budget within the system, power and temperature variations within the IGBT chips which are explained with aid of an analysis of the current variation within each bond wire.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132794389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896903
W. Alexander, R. Alexander
The use of solid materials in the form of thin foils for high flux cooling of electronic equipment is presented. The Foil And Slot Thermal (FAST) Conveyor is a new approach to heat transfer using thin solid foils running in narrow slots. Thermal fluxes above 150Wcm−2 are conservatively predicted with 20C foil to slot temperature differences at ambient temperatures between −40C to above 250C and over 2000Wcm−2 for refrigerated cooling systems. Theoretical models predict flux levels above 100Wcm−2 even at 100K. Prototypes using the same core technology in various configurations have been built and tested. Preliminary results from these experiments are discussed which indicate the potential of the new technology for high heat flux, wide operating temperature applications.
{"title":"Solid phase, high flux cooling of electronic equipment","authors":"W. Alexander, R. Alexander","doi":"10.1109/SEMI-THERM.2017.7896903","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896903","url":null,"abstract":"The use of solid materials in the form of thin foils for high flux cooling of electronic equipment is presented. The Foil And Slot Thermal (FAST) Conveyor is a new approach to heat transfer using thin solid foils running in narrow slots. Thermal fluxes above 150Wcm−2 are conservatively predicted with 20C foil to slot temperature differences at ambient temperatures between −40C to above 250C and over 2000Wcm−2 for refrigerated cooling systems. Theoretical models predict flux levels above 100Wcm−2 even at 100K. Prototypes using the same core technology in various configurations have been built and tested. Preliminary results from these experiments are discussed which indicate the potential of the new technology for high heat flux, wide operating temperature applications.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128290068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-03-13DOI: 10.1109/SEMI-THERM.2017.7896937
M. Seiß, T. Mrotzek, U. Jäntsch, M. Klimenkov, J. Reiser, W. Knabl
Molybdenum-copper-composites are interesting materials in the field of thermal management of gallium nitride based electronic devices. Depending on the application and packaging requirements, the coefficient of thermal expansion and thermal conductivity can be tailored for these composites by varying structure and composition. In this work, the interface between molybdenum and copper is studied. Transmission electron microscopy shows a sharp interface between the molybdenum and copper layers without interdiffusion zone. The low thermal contact resistance between the layers also suggests that there is sharp interface between molybdenum and copper. The electrical resistivity was measured and compared to estimations based on the Wiedemann-Franz law.
{"title":"The interface in molybdenum-copper-composites used for thermal management applications","authors":"M. Seiß, T. Mrotzek, U. Jäntsch, M. Klimenkov, J. Reiser, W. Knabl","doi":"10.1109/SEMI-THERM.2017.7896937","DOIUrl":"https://doi.org/10.1109/SEMI-THERM.2017.7896937","url":null,"abstract":"Molybdenum-copper-composites are interesting materials in the field of thermal management of gallium nitride based electronic devices. Depending on the application and packaging requirements, the coefficient of thermal expansion and thermal conductivity can be tailored for these composites by varying structure and composition. In this work, the interface between molybdenum and copper is studied. Transmission electron microscopy shows a sharp interface between the molybdenum and copper layers without interdiffusion zone. The low thermal contact resistance between the layers also suggests that there is sharp interface between molybdenum and copper. The electrical resistivity was measured and compared to estimations based on the Wiedemann-Franz law.","PeriodicalId":442782,"journal":{"name":"2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)","volume":"129 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122899999","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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