{"title":"Realization of an Integrated Planar LC Low-Pass Filter with Modified Surface Micromachining Technology","authors":"J. Fang, Z.W. Liu, Z.M. Chen, L.T. Liu, Z.J. Li","doi":"10.1109/EDSSC.2005.1635379","DOIUrl":null,"url":null,"abstract":"An Integrated Planar LC LPF(Low-Pass Filter) is designed and fabricated with Modified Surface Micromachining. The LPF is accomplished on low-resistance silicon substrate. To increase the performance of the filter, the substrate underneath the devices is modified with OPS (oxided porous silicon) technology. Measurement results give -3dB bandwidth of 2.925GHz and midband insertion loss of 0.874dB at 500MHz.","PeriodicalId":429314,"journal":{"name":"2005 IEEE Conference on Electron Devices and Solid-State Circuits","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE Conference on Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2005.1635379","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
An Integrated Planar LC LPF(Low-Pass Filter) is designed and fabricated with Modified Surface Micromachining. The LPF is accomplished on low-resistance silicon substrate. To increase the performance of the filter, the substrate underneath the devices is modified with OPS (oxided porous silicon) technology. Measurement results give -3dB bandwidth of 2.925GHz and midband insertion loss of 0.874dB at 500MHz.
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