{"title":"An Mcm-D Foundry from Copper/polyimid Tfml Bare Substrate to Multichif Modules","authors":"J.P. Droguet","doi":"10.1109/ICMCM.1994.753579","DOIUrl":null,"url":null,"abstract":"Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753579","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Description of the process, based on copper conductors and polyimid as a dielectric* (1) Description of the industrial pilot (2) Process characterization (3) Let us briefly remind, as described by fig. 1 hereunder, that the technology allows the realization of a multilayer stack, with up to five levels of conductors for power, ground, two signal layers and a top layer, for components attach and interconnect.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
