{"title":"Parameter space exploration for robust and high-performance n-channel and p-channel symmetric double-gate FinFETs","authors":"S. Tawfik, V. Kursun","doi":"10.1109/ASQED.2009.5206260","DOIUrl":null,"url":null,"abstract":"The influence of different device parameters on the electrical characteristics of n-channel and p-channel symmetric double-gate FinFETs is studied in this paper. Guidelines for enhancing the performance and suppressing the leakage currents are provided. A sub-threshold slope lower than 100mV is achieved at the room temperature with fins thinner than half the gate length in a 32nm FinFET technology. The maximum on-current to leakage current ratio of n-channel FinFETs at room temperature is achieved when the fin thickness and the gate-oxide thickness are 8nm and 1.6nm, respectively. Alternatively, the on-current to leakage currents ratio of p-channel FinFETs is maximized when the fin thickness and the gate-oxide thickness are 8nm and 1.2nm, respectively.","PeriodicalId":437303,"journal":{"name":"2009 1st Asia Symposium on Quality Electronic Design","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 1st Asia Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASQED.2009.5206260","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The influence of different device parameters on the electrical characteristics of n-channel and p-channel symmetric double-gate FinFETs is studied in this paper. Guidelines for enhancing the performance and suppressing the leakage currents are provided. A sub-threshold slope lower than 100mV is achieved at the room temperature with fins thinner than half the gate length in a 32nm FinFET technology. The maximum on-current to leakage current ratio of n-channel FinFETs at room temperature is achieved when the fin thickness and the gate-oxide thickness are 8nm and 1.6nm, respectively. Alternatively, the on-current to leakage currents ratio of p-channel FinFETs is maximized when the fin thickness and the gate-oxide thickness are 8nm and 1.2nm, respectively.