Parameter space exploration for robust and high-performance n-channel and p-channel symmetric double-gate FinFETs

S. Tawfik, V. Kursun
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引用次数: 3

Abstract

The influence of different device parameters on the electrical characteristics of n-channel and p-channel symmetric double-gate FinFETs is studied in this paper. Guidelines for enhancing the performance and suppressing the leakage currents are provided. A sub-threshold slope lower than 100mV is achieved at the room temperature with fins thinner than half the gate length in a 32nm FinFET technology. The maximum on-current to leakage current ratio of n-channel FinFETs at room temperature is achieved when the fin thickness and the gate-oxide thickness are 8nm and 1.6nm, respectively. Alternatively, the on-current to leakage currents ratio of p-channel FinFETs is maximized when the fin thickness and the gate-oxide thickness are 8nm and 1.2nm, respectively.
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鲁棒和高性能n通道和p通道对称双栅极finfet的参数空间探索
本文研究了不同器件参数对n沟道和p沟道对称双栅finfet电特性的影响。提供了提高性能和抑制泄漏电流的指南。在32nm FinFET技术中,在室温下,鳍片厚度小于栅极长度的一半,可以实现低于100mV的亚阈值斜率。室温下n沟道finfet的导通/漏流比在翅片厚度为8nm和栅极-氧化物厚度分别为1.6nm时达到最大值。当翅片厚度为8nm,栅极-氧化物厚度为1.2nm时,p沟道finfet的导通/漏流比最大。
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