Thermal characterization of TBGA package for an integration in board level analysis

Abstract

The present study numerically investigates the thermal characterization of a 420 ball copper lid ball grid array (TBGA) package. The purpose of this work is to study a thermal characterization approach for determining the resistances of a two-resistor thermal model. The investigation employed different boundary conditions to obtain the thermal resistances through the package. This compact model was numerically validated by comparison with its detailed equivalent in a board level simulation. The results indicate that the accuracy of the two resistor compact modeling approach depends on the boundary conditions such as the approaching velocity and the thermal conductivity of the PCB.