Direct junction temperature measurement in high-power LEDs

P. Fulmek, G. Langer, F. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, J. Nicolics
{"title":"Direct junction temperature measurement in high-power LEDs","authors":"P. Fulmek, G. Langer, F. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, J. Nicolics","doi":"10.1109/ISSE.2014.6887563","DOIUrl":null,"url":null,"abstract":"The light quality and long-term stability of phosphor converted light-emitting diodes (LEDs) for luminaires depend on the temperature distribution inside the LED chip and the color conversion element. Therefore, a reliable and accurate method to establish the LED's junction temperature is required to further improve and optimize high quality LED luminaires. In this paper we describe the development and application of an innovative junction temperature measurement method which is based on a precise and universally applicable calibration procedure, allowing to use the calibrated LED itself as a temperature sensor under the respective operation condition of interest. This method is based on an extremely fast pulse measurement procedure allowing to record pairs of forward current and voltage drop values periodically every microsecond starting from the first microsecond of a pulse. From these experiments we reap two kinds of result: (1) Independent of the pulse shape in our experiments we observe a constant relation of current-to-voltage drop which we interpret as a constant junction conductivity. Depending on the type of LED (but independent of the packaging technology) we obtain a constant junction conductivity throughout several ten microseconds which we understand as a proof that the junction temperature did not change during this very first pulse phase. (2) The junction conductivity obtained in this moment is a measure for the junction temperature so that a calibration can be made by comparison with an independent steady-state temperature measurement made at zero-current condition. The method has been successfully applied to thermally characterize high-power LED modules as a 3 × 3 LED arrays with color conversion glob tops built-up on an insulated metal substrate (IMS).","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887563","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

The light quality and long-term stability of phosphor converted light-emitting diodes (LEDs) for luminaires depend on the temperature distribution inside the LED chip and the color conversion element. Therefore, a reliable and accurate method to establish the LED's junction temperature is required to further improve and optimize high quality LED luminaires. In this paper we describe the development and application of an innovative junction temperature measurement method which is based on a precise and universally applicable calibration procedure, allowing to use the calibrated LED itself as a temperature sensor under the respective operation condition of interest. This method is based on an extremely fast pulse measurement procedure allowing to record pairs of forward current and voltage drop values periodically every microsecond starting from the first microsecond of a pulse. From these experiments we reap two kinds of result: (1) Independent of the pulse shape in our experiments we observe a constant relation of current-to-voltage drop which we interpret as a constant junction conductivity. Depending on the type of LED (but independent of the packaging technology) we obtain a constant junction conductivity throughout several ten microseconds which we understand as a proof that the junction temperature did not change during this very first pulse phase. (2) The junction conductivity obtained in this moment is a measure for the junction temperature so that a calibration can be made by comparison with an independent steady-state temperature measurement made at zero-current condition. The method has been successfully applied to thermally characterize high-power LED modules as a 3 × 3 LED arrays with color conversion glob tops built-up on an insulated metal substrate (IMS).
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大功率led的直接结温测量
灯具用荧光粉转换发光二极管(LED)的光质量和长期稳定性取决于LED芯片和颜色转换元件内部的温度分布。因此,需要一种可靠、准确的方法来确定LED的结温,以进一步改进和优化高质量的LED灯具。在本文中,我们描述了一种创新的结温测量方法的开发和应用,该方法基于精确且普遍适用的校准程序,允许在各自感兴趣的操作条件下使用校准的LED本身作为温度传感器。该方法基于极快的脉冲测量程序,允许从脉冲的第一微秒开始,每微秒周期性地记录正向电流和电压降值对。从这些实验中,我们得到了两种结果:(1)在我们的实验中,我们观察到电流与电压降的恒定关系,我们将其解释为恒定的结电导率。根据LED的类型(但与封装技术无关),我们在几十微秒内获得恒定的结电导率,我们将其理解为结温度在第一个脉冲阶段没有变化的证明。(2)在这一时刻得到的结电导率是结温度的测量值,因此可以通过与在零电流条件下进行的独立稳态温度测量进行比较来进行校准。该方法已成功地应用于高功率LED模块的热表征,作为3 × 3 LED阵列,其颜色转换球体顶部构建在绝缘金属衬底(IMS)上。
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