Generic heterogeneously integrated III-V lasers-on-chip with metal-coated etched-mirror

SPIE OPTO Pub Date : 2016-05-03 DOI:10.1117/12.2218395
Chee-Wei Lee, D. Ng, M. Ren, Y. Fu, Anthony Yew Seng Kay, V. Krishnamurthy, Jing Pu, Ai Ling Tan, F. Tjiptoharsono, Soo Bin Choo, Qian Wang
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Abstract

We demonstrate electrically-pumped III-V quantum-well lasers bonded on SiO2 with a metal-coated etched-mirror. The metal-coated etched-mirror allow the lasers to be used as on-chip laser, but our process design make sure that it requires no additional fabrication step to fabricate the metal-coated etched mirror. The bonded III-V on SiO2 also permits tight laser mode confinement in the active region due to high index contrast between III-V and SiO2. Moreover, it promises a flexible choice of host substrate, in which the silicon substrate could also be replaced with other materials. The laser devices demonstrated have the lowest threshold of 50 mA, a maximum output power of 9 mW and a differential quantum efficiency of 27.6%.
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通用异质集成III-V激光片与金属涂层蚀刻镜
我们演示了电泵III-V量子阱激光器与金属涂层蚀刻镜结合在SiO2上。金属涂层蚀刻镜允许激光器作为片上激光器使用,但我们的工艺设计确保它不需要额外的制造步骤来制造金属涂层蚀刻镜。由于III-V和SiO2之间的高折射率对比,在SiO2上键合的III-V还允许在活性区域内严格的激光模式约束。此外,它提供了一个灵活的基底选择,其中硅基底也可以用其他材料代替。所演示的激光器最低阈值为50 mA,最大输出功率为9 mW,差分量子效率为27.6%。
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Silent images in dialogue Integrating III-V, Si, and polymer waveguides for optical interconnects: RAPIDO Quantum nonlinear optics: nonlinear optics meets the quantum world (Conference Presentation) Merging photonics with nanoelectronics (Conference Presentation) Generic heterogeneously integrated III-V lasers-on-chip with metal-coated etched-mirror
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