Formation of very fine pit and dot arrays using EB writing for ultrahigh density storage toward 1 Tb/in2

S. Hosaka, H. Sano, A. Miyachi, K. Itoh, H. Sone
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Abstract

Fabrication of ultrahigh packed pit and dot arrays have been studied using conventional electron beam (EB) writing, and positive and negative EB resists, ZEP520 and calixarene, respectively. Using fine electron beam with high probe current and very thinner resists, we demonstrate that the negative resist has a potential to achieve an ultrahigh density storage with both bit pitch (BP) and track pitch (TP) of <30 nm and a dot diameter of <15 nm, although the positive resist has a limitation at a BP of 60nm and a TP of 40nm. This dot array opens a way toward >1 trillion bits per inch2(Tb/in2) storage technology.
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使用EB写入形成非常精细的坑和点阵列,用于达到1tb /in2的超高密度存储
研究了采用传统电子束(EB)刻蚀技术,采用ZEP520和杯芳烃作为正负电子束电阻,制备超高填充凹坑阵列和点阵列。利用具有高探针电流的精细电子束和非常薄的电阻,我们证明了负电阻具有实现超高密度存储的潜力,其比特间距(BP)和磁道间距(TP)均为1万亿比特/英寸2(Tb/in2)存储技术。
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