{"title":"Investigating the thermal response of a micro-optical shutter","authors":"C.C. Wong, S. Graham","doi":"10.1109/ITHERM.2002.1012576","DOIUrl":null,"url":null,"abstract":"This paper discusses the thermal analysis of a fully integrated micro-switch for surety applications. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a micro-laser. To analyze the shutter response, a 'Design-to-Analysis' interface has been built that generates an accurate 3-D solid geometry from the 2-D mask layout. Besides performing analysis, engineers can also use this solid modeler to virtually prototype and verify a design before fabrication. A parametric study is performed to determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
This paper discusses the thermal analysis of a fully integrated micro-switch for surety applications. Specifically, this study focuses on the temperature increase of a micromachined optical shutter with spot heating from a micro-laser. To analyze the shutter response, a 'Design-to-Analysis' interface has been built that generates an accurate 3-D solid geometry from the 2-D mask layout. Besides performing analysis, engineers can also use this solid modeler to virtually prototype and verify a design before fabrication. A parametric study is performed to determine the effects of thermal conductivity and contact resistance on the thermal response of this passively cooled device.