Normally-off type GaAs MESFET for low power, high speed logic circuits

H. Ishikawa, H. Kusakawa, K. Suyama, M. Fukuta
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引用次数: 37

Abstract

wave amplifiers, but for high speed switching circuits’. Some of the logic using normally-on type GaAs MESFETs have large power dissipation and complicated circuit construction. The normally-off type GaAs MESFET logic has not as yet been reported, even though it is expected to have some attractive features such as low power dissipation and simple circuit configuration. Figure 1 is a microphotograph of the buffered output 13-stage ring oscillator consisting of normally-off type GaAs MESFETs and epitaxial resistors. A cutaway view of the inverter used in the ring oscillator is shown in Figure 2. The devices were fabricated on a sulfur-doped N-type epitaxial layer grown by VPE onto a semi-insulating Cr-doped substrate. The do ing density and thickness of the epitaxial layer was 1 x 101’cm-3 and 0.1 pm, respectively. The N-type layer outside the active area was etched down to the semiinsulating substrate to isolate inverters from each other. A dual-metal system was used. 0.04-pm thick Au-Ge eutectic alloy and 0.4-pm thick Au were continuously deposited as the first metal layer and were alloyed at 450’C for 120 seconds to make ohmic contact. Next, O.5pm-thick Si02 film which was used for the isolation of the dual metal layers was deposited by Chemical Vapor Deposition (CVD). This film was etched selectively to open the gate windows and the contact holes to the first metal layer. The second metal layer made with Cr-Pt-Au was used for the Schottky gate and crossing over or connecting to the GaAs MESFETs are substantially useful not only for micro-
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用于低功率、高速逻辑电路的常关型GaAs MESFET
波放大器,但用于高速开关电路。一些采用常导通型GaAs mesfet的逻辑器件功耗大,电路结构复杂。正常关断型GaAs MESFET逻辑尚未被报道,尽管它有望具有一些吸引人的特性,如低功耗和简单的电路配置。图1是由常关型GaAs mesfet和外延电阻组成的缓冲输出13级环形振荡器的显微照片。环形振荡器中使用的逆变器的剖面图如图2所示。该器件是在半绝缘掺杂cr衬底上由VPE生长的掺硫n型外延层上制备的。外延层的密度和厚度分别为1 x 101'cm-3和0.1 pm。有源区外的n型层被蚀刻到半绝缘衬底上,以隔离逆变器彼此。采用双金属系统。0.04 pm厚的Au- ge共晶合金和0.4 pm厚的Au作为第一金属层连续沉积,在450℃下合金化120秒形成欧姆接触。其次,采用化学气相沉积(CVD)法制备0.5 pm厚的sio2膜,用于隔离双金属层。该薄膜被选择性地蚀刻以打开栅极窗和第一金属层的接触孔。由Cr-Pt-Au制成的第二层金属层用于肖特基栅极,并且交叉或连接到GaAs mesfet不仅在微观上有用
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The pretuned module: An integrated millimeter wave oscillator A selection system for MNOS capacitor memories A 32 x 9 ECL dual address register using an interleaving cell technique A 16-bit monolithic I3L processor 4-GHz frequency division with GaAs MESFET ICs
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