Evaluation of multilevel memory capability of ReRAM using Ta2O5 insulator and different electrode materials

Yuanlin Li, Reon Katsumura, Mika Grönroos, A. Tsurumaki‐Fukuchi, M. Arita, H. Andoh, T. Morie, Yasuo Takahashi
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Abstract

ReRAM (Resistive Random Access Memory) has been drawing attention for its neural network applications with low-power and high-speed operation. The multilevel data storage capability is inherently needed to use the ReRAM as synaptic devices. In this study, two ReRAM devices with different electrode materials in which the operation mechanisms are thought to be different was fabricated and tested. It was clarified that the multilevel resistance characteristics were achieved in both devices.
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采用Ta2O5绝缘体和不同电极材料的ReRAM多层存储性能评价
电阻式随机存取存储器(ReRAM)以其低功耗、高速运行的神经网络应用而备受关注。使用ReRAM作为突触设备,需要具有多层数据存储能力。在本研究中,制备了两种不同电极材料的ReRAM器件,并对其操作机制进行了测试。结果表明,两种器件均实现了多电平电阻特性。
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