Thermal design of a disk-array system

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) Pub Date : 2002-08-07 DOI:10.1109/ITHERM.2002.1012445

R. Huang, D. L. Chung

{"title":"Thermal design of a disk-array system","authors":"R. Huang, D. L. Chung","doi":"10.1109/ITHERM.2002.1012445","DOIUrl":null,"url":null,"abstract":"A procedure for solving the thermal problems of a fan-cooled disk-array system is developed for industrial application. The procedure requires both the measurements of the temperatures of key components at various air flow rates across a single hard-disk and the computational simulations of isothermal flows for a preliminarily designed mechanical configuration of a system by employing a commercial CFD software package. The flow rate and pressure drop of the air stream across a single-disk are measured with an AMCA 210 flow bench. The temperatures of the components are detected by the fine-wire thermocouples. The methodology of the development of the disk array and the like is illustrated by an example. The results show that the single-disk experiment can provide the designer with the means to determine the air flow rate for desired operation temperatures of key components. The calculated flow rate and pressure drop can be used to match selected fans to the system. The prediction correlates well with the experimental values. The calculated flow patterns can be used to improve the preliminary design of the system mechanical configuration.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012445","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

Abstract

A procedure for solving the thermal problems of a fan-cooled disk-array system is developed for industrial application. The procedure requires both the measurements of the temperatures of key components at various air flow rates across a single hard-disk and the computational simulations of isothermal flows for a preliminarily designed mechanical configuration of a system by employing a commercial CFD software package. The flow rate and pressure drop of the air stream across a single-disk are measured with an AMCA 210 flow bench. The temperatures of the components are detected by the fine-wire thermocouples. The methodology of the development of the disk array and the like is illustrated by an example. The results show that the single-disk experiment can provide the designer with the means to determine the air flow rate for desired operation temperatures of key components. The calculated flow rate and pressure drop can be used to match selected fans to the system. The prediction correlates well with the experimental values. The calculated flow patterns can be used to improve the preliminary design of the system mechanical configuration.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

磁盘阵列系统的热设计

本文提出了一种适用于工业应用的风扇冷却磁盘阵列系统的热问题求解方法。该程序既需要在单个硬盘上测量不同气流速率下关键部件的温度，也需要使用商业CFD软件包对初步设计的系统机械结构进行等温流动的计算模拟。利用amca210流动台测量了单盘气流的流量和压降。组件的温度由细线热电偶检测。通过实例说明了磁盘阵列等的开发方法。结果表明，单盘实验可以为设计人员提供确定关键部件所需工作温度下的空气流量的手段。计算出的流量和压降可用于将选定的风机与系统匹配。预测结果与实验值吻合良好。计算得到的流型可用于改进系统机械结构的初步设计。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)

自引率

0.00%

发文量