Test chips, test systems and thermal test data for multichip modules in the ESPRIT-APACHIP project

Abstract

Details of four multichip module cooling techniques using common test chips and test methods in the ESPRIT Project 2075, APACHIP, are presented. The project is concerned with the development of technology and manufacturing capabilities for single-chip packages and multichip modules. Descriptions and test results of cooling techniques investigated for multichip modules are provided. These include heat-pipes, immersion in inert fluid, water-cooled thin membrane, and direct-chip on water-cooled cold plate. Two 12-mm/sup 2/ thermal test chips which have been developed (NMRC) for characterization of thermal demonstrators are described. Test systems established for diode temperature sensor calibration and thermal characterization of demonstrators are described and compared. Statistical errors amounted to less than +or-1%. Systematic errors are less than +or-10%.<>