{"title":"Multigrid solver for 2D heat conduction problems","authors":"Y. Y. Koh, J. Lim, Y. L. Chua","doi":"10.1063/1.5118041","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":112912,"journal":{"name":"APPLIED PHYSICS OF CONDENSED MATTER (APCOM 2019)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"APPLIED PHYSICS OF CONDENSED MATTER (APCOM 2019)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/1.5118041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
