A. Hesford, J. Morsey, W. Chew, A. Deutsch, H.H. Smith
{"title":"Parallelization of the Reduced-Coupling Technique for a Method-of-Moments-Based Field Solver Used for Product-Level Wide Data-Bus Analysis","authors":"A. Hesford, J. Morsey, W. Chew, A. Deutsch, H.H. Smith","doi":"10.1109/EPEP.2007.4387196","DOIUrl":null,"url":null,"abstract":"A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387196","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is shown for a wide, on-chip data-bus that required one million surface unknowns and the computational power of a 1024-node IBM BlueGene cluster with distributed memory.