Use of periodic structure approach to model packaged MMIC and interconnects

Abstract

An approach based on the periodic structure model is developed for full-wave electromagnetic analysis of shielded microstrip components and interconnects on multilayered substrate. The spectral domain integral equation approach is employed in conjunction with the Method of Moments and the Galerkin testing procedure. General planar and certain three dimensional structures such as vias, air bridges and bond wires are analyzed efficiently using the presented technique. The method has been recently extended to analyze open MMIC, so EMC/EMI effects such as radiation from interconnect structures and packaged systems can also be analyzed efficiently. The presented approach includes package resonances and radiation losses. Scattering parameters for MMIC and interconnects in both open and packaged environment are shown.