{"title":"An X-Band Robust GaN Low-Noise Amplifier MMIC with sub 2 dB Noise Figure","authors":"Oguz Kazan, F. Koçer, O. Aydin Civi","doi":"10.23919/eumc.2018.8541809","DOIUrl":null,"url":null,"abstract":"This paper presents a low-noise amplifier (LNA) operating between 8−11 GHz. Measurement results show that the LNA has a gain of more than 20 dB while achieving a noise figure of less than 2 dB. The three stage topology achieves high linearity, providing an OIP3 of 29 dBm at 0.6 W power dissipation. The robustness tests show that the circuit survives to at least 2.5 W (34 dBm) input power. With a size of just 2.8 × 1.3 mm2(3.6 mm2) the presented LNA is compact when compared to the state of the art. The circuit is realized using the 0.25 μm Power GaN/SiC HEMT process by WIN Semiconductor.","PeriodicalId":248339,"journal":{"name":"2018 13th European Microwave Integrated Circuits Conference (EuMIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 13th European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/eumc.2018.8541809","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a low-noise amplifier (LNA) operating between 8−11 GHz. Measurement results show that the LNA has a gain of more than 20 dB while achieving a noise figure of less than 2 dB. The three stage topology achieves high linearity, providing an OIP3 of 29 dBm at 0.6 W power dissipation. The robustness tests show that the circuit survives to at least 2.5 W (34 dBm) input power. With a size of just 2.8 × 1.3 mm2(3.6 mm2) the presented LNA is compact when compared to the state of the art. The circuit is realized using the 0.25 μm Power GaN/SiC HEMT process by WIN Semiconductor.