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2018 13th European Microwave Integrated Circuits Conference (EuMIC)最新文献

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Design and Implementation of an Encapsulated GaN X-Band Power Amplifier Family 封装GaN x波段功率放大器系列的设计与实现
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539902
Onur Memioglu, A. Karakuzulu, A. Gundel, F. Koçer, O. Aydin Civi
This paper describes the design and verification results of two wideband class AB High Power Amplifiers (PA), encapsulated in commercial packages. Both amplifiers designed on WIN Semiconductors' 0.25 $mu$ m GaN on SiC technology. The selected GaN process features compact common-source (CS) transistor layouts with individual source grounding vias. The family spans the whole X-band frequency with the first design tuned between 7–11 GHz and the second design tuned between 10–12 GHz. Both designs have saturated power output greater than 25 W throughout the whole bandwidth with peak power added efficiency at 30%. A multistage power combining matching strategy to achieve a tradeoff in wideband performance and power output is given. In depth discussion of the MMIC design of the PAs is supported by a discussion of the thermal management of the packages, including the PCB design and active cooling methodology, in order to present a fully functional PA family.
本文介绍了两种商用封装的宽带AB类大功率放大器(PA)的设计和验证结果。两款放大器均采用WIN半导体的0.25美元/ μ美元GaN on SiC技术设计。所选择的GaN工艺具有紧凑的共源(CS)晶体管布局,具有单独的源接地过孔。该系列跨越整个x波段频率,第一种设计在7-11 GHz之间调谐,第二种设计在10-12 GHz之间调谐。这两种设计在整个带宽内的饱和功率输出都大于25w,峰值功率增加效率为30%。提出了一种多级功率组合匹配策略,以实现宽带性能和功率输出的平衡。为了呈现一个功能齐全的PA系列,在对PA的MMIC设计进行深入讨论的同时,还讨论了封装的热管理,包括PCB设计和主动冷却方法。
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引用次数: 1
A 28-GHz CMOS 2×4 Phased Array Chip with High-Precision Phase-Adjusting Function Between Subarrays for Beam Multiplexing 一种具有高精度子阵间相位调节功能的28 ghz CMOS 2×4相控阵芯片,用于波束复用
Pub Date : 2018-09-01 DOI: 10.23919/eumc.2018.8541612
T. Shimura, T. Ohshima, Shohei Ishikawa, Shunsuke Fujio, Kazuyuki Ozaki, H. Ishikawa, Ken-ichi Nishikawa, M. Shimizu, Y. Ohashi
We propose a transmitter configuration with a phase-adjusting function between subarrays for beam multiplexing. We demonstrate a 28-GHz CMOS phased array chip with a phase-adjusting function for a beam-multiplexing transmitter. The phased array chip has two subarrays, each having four transmit channels to accurately set output phases and amplitudes via a multi-channel 10-bit-resolution digital-to-analog converter. The phase-setting resolution of the chip is less than 1.0°. The phase array chip also has nine mixers for detecting the phase difference between subarrays in the chip, between channels in the subarray, and between the chip and another chip. The measured root-mean-square (RMS) output phase error and the measured RMS phase-difference detection error of the chip are both 0.7°. Using this chip with a high-precision phase-adjusting function, it is possible to realize a transmitter with a signal-to-interference ratio of over 25 dB for beam multiplexing. We also propose an antenna configuration for two-dimensional beam scanning and horizontal beam multiplexing using the phased array chips.
我们提出了一种具有子阵列间相位调节功能的发射机结构,用于波束复用。我们演示了一种用于波束复用发射机的具有相位调节功能的28 ghz CMOS相控阵芯片。相控阵芯片有两个子阵列,每个子阵列有四个传输通道,通过多通道10位分辨率数模转换器精确设置输出相位和幅度。该芯片的相位设定分辨率小于1.0°。相控阵芯片还具有9个混频器,用于检测芯片中的子阵列之间、子阵列中的通道之间以及芯片与另一芯片之间的相位差。测得的芯片输出相位误差均方根(RMS)和测得的芯片相位差检测误差均方根(RMS)均为0.7°。利用该芯片具有高精度相位调节功能,可以实现信号干扰比超过25 dB的波束复用发射机。我们还提出了一种使用相控阵芯片进行二维波束扫描和水平波束复用的天线配置。
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引用次数: 1
A Gain-Boosted 52–142 GHz Band-Pass Distributed Amplifier in O.13μm SiGe Process with fmax of 210GHz 0.13 μm SiGe工艺增益增强52-142 GHz带通分布式放大器,fmax为210GHz
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539945
H. Rashtian, O. Momeni
A band-pass gain-boosted distributed amplifier is proposed. The amplifier achieves a bandwidth of 90 GHz at center frequency of 97 GHz and operates up to frequencies as high as 0.67fmax of the transistors. A novel gain-boosted cascode structure as well as band-pass transmission lines are employed to significantly boost the bandwidth and the highest operation frequency of the amplifier. The amplifier shows an average gain of 14.4 dB from 52 GHz to 142 GHz in a 0.13-μm SiGe process with fmax of 210 GHz.
提出了一种带通增益增强分布式放大器。该放大器在中心频率为97 GHz时实现了90 GHz的带宽,并且工作频率高达晶体管的0.67fmax。采用一种新型的增益增强级联码结构和带通传输线,大大提高了放大器的带宽和最高工作频率。该放大器在0.13 μm SiGe工艺下,在52 ~ 142 GHz范围内的平均增益为14.4 dB, fmax为210 GHz。
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引用次数: 2
A Multipurpose 76 GHz Radar Transceiver System for Automotive Applications Based on SiGe MMICs 基于SiGe mmic的多用途76ghz汽车雷达收发器系统
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539885
Jan Schoepfel, S. Kueppers, K. Aufinger, N. Pohl
In this paper a SiGe chipset for automotive applications in the band around 76 GHz is presented. The first MMIC contains a VCO at a frequency of 38 GHz for LO generation. The second MMIC encloses a complete transceiver at 76 GHz. The main goal of this work is to create a first functional version of a VCO and an one channel transceiver MMIC. With these MMICs it will be possible to build up multipurpose radar systems with a variable number of transceivers, to construct MIMO architectures. What makes this system innovative is the fact, that it is able to handle broader signals than know systems. Furthermore it isn't limited to one modulation scheme. It is possible to transmit and receive any signal form with platforms build out of these chips. The VCO MMIC achieves a tuning frequency range of 5 GHz with a center frequency of 35 GHz. It consumes 152 mW from a 3.3 V supply. The transceiver MMIC is fully functional and achieves a saturated output power of 9.5 dBm drawing 570 mW from a 3.3 V supply.
本文提出了一种适用于76 GHz频段汽车应用的SiGe芯片组。第一个MMIC包含一个频率为38 GHz的压控振荡器,用于产生LO。第二个MMIC封装了一个完整的76 GHz收发器。这项工作的主要目标是创建VCO和单通道收发器MMIC的第一个功能版本。有了这些mmic,将有可能建立具有可变数量收发器的多用途雷达系统,以构建MIMO架构。这个系统的创新之处在于,它能够处理比已知系统更广泛的信号。此外,它不限于一种调制方案。用这些芯片构建的平台可以传输和接收任何形式的信号。VCO MMIC实现了5 GHz的调谐频率范围,中心频率为35 GHz。它从3.3 V电源消耗152兆瓦。收发器MMIC功能齐全,从3.3 V电源获得570mw的饱和输出功率为9.5 dBm。
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引用次数: 5
Broadband and Highly Accurate X-Band Vector-Sum Phase Shifter Using LC-Type Power Splitter 采用lc型功率分配器的宽带高精度x波段矢量和移相器
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539953
Takanobu Fujiwara, M. Shimozawa
In recent years, for the realization of the low-cost and multi-band AP AA (Active Phased Array Antenna) system, broadband and highly accurate vector-sum phase shifter has attracted the attention. To realize such a vector-sum phase shifter, one of the difficulty arises from the trade-off between a bandwidth and an insertion loss of the PPF (Poly Phase Filter) which is deployed at the first stage inside the phase shifter and generates quadrature signals from a differential signal. In order to ease the trade-off of PPF, we propose the PPF using inductor and capacitor (LC-type) power splitter implemented in front of it. Simulation results with the proposed technique show the improvement of 2.7dB in the insertion loss, without degradation of the bandwidth. As a proof of concept, vector-sum phase shifter with the proposed PPF technique was fabricated using 0.18um SiGe BiCMOS process. Measurement results showed the 3dB gain bandwidth of 64% at X-band and the RMS phase error of less than 2.1°. This broadband and highly accurate results show that the proposed PPF technique is effective to realize multi-band AP AA system in the near future.
近年来,为了实现低成本、多频段的有源相控阵天线系统,宽带、高精度矢量和移相器引起了人们的关注。为了实现这样一个矢量和移相器,其中一个困难来自于带宽和PPF(多相滤波器)的插入损耗之间的权衡,该滤波器部署在移相器内部的第一级,并从差分信号产生正交信号。为了减轻PPF的权衡,我们提出了在PPF前面实现电感和电容(lc型)功率分配器的PPF。仿真结果表明,在不降低带宽的情况下,该技术的插入损耗提高了2.7dB。作为概念验证,采用0.18um SiGe BiCMOS工艺制作了具有PPF技术的矢量和移相器。测量结果表明,x波段3dB增益带宽为64%,均方根相位误差小于2.1°。这一宽带和高精度的结果表明,所提出的PPF技术在不久的将来是实现多频段AP AA系统的有效方法。
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引用次数: 7
79–85GHz CMOS Amplifier with 0.35V Supply Voltage 79-85GHz CMOS放大器,0.35V电源电压
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539891
R. Dong, K. Katayama, K. Takano, Sangyeop Lee, T. Yoshida, S. Amakawa, M. Fujishima
A low-power W-band CMOS amplifier with a 0.35 V supply voltage is presented. It achieves a peak gain of 12.5 dB and consumes a power of 3.1 mW. However, the maximum available gain (MAG) or maximum stable gain (MSG) of transistor degrades markedly because of the low supply voltage and the near maximum oscillation frequency, fmax. Thus, gain-boosting techniques must be employed to enhance the transistor's gain. An intuitive method, which involves drawing a set of circles, was presented to explain how the feedback network boosts the MAG to its highest value (Gmax). The method was employed in the design of the amplifier with a 0.35 V supply voltage.
设计了一种电源电压为0.35 V的低功率w波段CMOS放大器。它的峰值增益为12.5 dB,功耗为3.1 mW。然而,晶体管的最大可用增益(MAG)或最大稳定增益(MSG)由于低电源电压和接近最大振荡频率(fmax)而显著下降。因此,必须采用增益增强技术来提高晶体管的增益。提出了一种直观的方法,即画一组圆,来解释反馈网络如何将MAG提高到最大值(Gmax)。将该方法应用于电源电压为0.35 V的放大器设计中。
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引用次数: 0
An E-Band Variable Gain Low Noise Amplifier in 90-nm CMOS Process Using Body-Floating and Noise Reduction Techniques 采用浮体和降噪技术的90纳米CMOS工艺e波段可变增益低噪声放大器
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539883
Yunshan Wang, Chun-Nien Chen, Yi-Ching Wu, Huei Wang
A variable gain low noise amplifier (VGLNA) for millimeter-wave (MMW) wireless communication is proposed in this paper. This VGLNA is implemented using 90-nm CMOS process. It shows small signal gain greater than 20.9 dB from 68.9 to 87.6 GHz with 2.5-dB variation and a dc consumption 56 mW. The gain control range is 2.3 to 21.1 dB at center frequency. The measured minimum noise figure (NF) is 5.3 dB at 80 GHz. This work shows the best noise performance of LNAs in 90-nm CMOS at similar frequencies and comparable figure of merit to those MMW LNAs in better IC process.
提出了一种用于毫米波无线通信的可变增益低噪声放大器(VGLNA)。该VGLNA采用90纳米CMOS工艺实现。从68.9到87.6 GHz,信号增益大于20.9 dB,变化2.5 dB,直流功耗为56 mW。增益控制范围在中心频率为2.3至21.1 dB。测量到的最小噪声系数(NF)在80 GHz时为5.3 dB。这项工作表明,在相似的频率下,90纳米CMOS中的lna与更好的IC工艺中的毫米波lna相比具有最佳的噪声性能。
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引用次数: 8
Three Stage 5-18.5 GHz High Gain and High Power Amplifier Based on 0.15 μm GaN Technology 基于0.15 μm GaN技术的三级5-18.5 GHz高增益高功率放大器
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539866
M. Dinari, G. Mouginot, E. Byk, V. Brunel, C. Chang, L. Brunel, M. Camiade
This paper presents a wideband three stage monolithic HPA design and characterizations. It is realized on UMS 0.15 μm GaN technology on SiC substrate. The main challenge was to find a good trade-off between RF characteristics (power, Power Added Efficiency, gain flatness and Input/Output return loss in a wide frequency range), thermal characteristics, and chip size: this was achieved by combining distributed (first stage) and reactively matched (second and third stages) architectures. The characterization results show an output power from 5.5 W to 9 W, an average PAE of 22% and a small signal gain higher than 30 dB over the frequency band 5-18.5 GHz. These performances are obtained in test fixture, and in Continuous Wave mode (CW).
本文提出了一种宽带三级单片HPA的设计和特性。它是在SiC衬底上采用ums0.15 μm GaN技术实现的。主要的挑战是在射频特性(功率、功率附加效率、增益平坦度和宽频率范围内的输入/输出回波损耗)、热特性和芯片尺寸之间找到一个良好的权衡:这是通过结合分布式(第一阶段)和反应匹配(第二和第三阶段)架构来实现的。表征结果表明,在5-18.5 GHz频段内,输出功率为5.5 W至9 W,平均PAE为22%,信号增益小于30 dB。这些性能是在测试夹具和连续波模式(CW)下获得的。
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引用次数: 2
Detailed Study of Zero Temperature Coefficients for Microwave GaAs and GaN FETs 微波GaAs和GaN场效应管零温度系数的详细研究
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539882
M. Alim, A. Rezazadeh, C. Gaquière
Detailed study of zero temperature coefficients (ZTC) for microwave GaAs and GaN based high electron mobility transistors were reported and analysed. The measured temperature-dependent data between −40 to 150°C were observed of transconductance and drain current for the both devices. It was found that the variation of threshold voltage (V T) with the drain bias (V ds) has an influence on zero temperature coefficient points. Furthermore, the drain current based ZTC point arises before VT for GaN and after VT for GaAs FETs with respect to drain bias. Inconsistency are observed; most conspicuously that the temperature trends of the threshold voltage for these two device technologies are utterly contrasting. In addition, transconductance based ZTC is absent in GaN device. Furthermore, the effective mobility is estimated using an improved model for the GaN device. The results indicate a well-confined 2-DEG with high mobility as the peak value of effective mobility closely corresponds with the Hall mobility. This work provides some worthwhile insights in microwave circuits design for high temperature applications.
对微波GaAs和GaN基高电子迁移率晶体管的零温度系数进行了详细的研究和分析。在- 40至150°C之间,观察到两种器件的跨导和漏极电流的测量温度相关数据。发现阈值电压(V T)随漏极偏压(V ds)的变化对零温度系数点有影响。此外,关于漏极偏置,基于漏极电流的ZTC点在GaN的VT之前出现,而在GaAs fet的VT之后出现。观察到不一致;最明显的是,这两种器件技术的阈值电压的温度趋势完全相反。此外,在GaN器件中不存在基于跨导的ZTC。此外,利用改进的模型估计了GaN器件的有效迁移率。结果表明,有效迁移率的峰值与霍尔迁移率密切相关,具有良好的约束和高迁移率的2-DEG。这项工作为高温应用的微波电路设计提供了一些有价值的见解。
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引用次数: 1
A Systematic Investigation of Behavioural Model Complexity Requirements 行为模型复杂性需求的系统研究
Pub Date : 2018-09-01 DOI: 10.23919/EUMIC.2018.8539950
M. Rocio Moure, M. Casbon, M. Fernández-Barciela, P. Tasker
In the design of power amplifiers, it is necessary to model the transistor behaviour at high compression levels and accurately predict load-pull power and efficiency contours as well as harmonics. For this purpose, nonlinear behavioural model approaches have been successfully used, like Cardiff model. In this paper, a systematic study is presented on the complexity required for the Cardiff model to achieve a given precision when targeting different load-pull contour design requirements for a GaN HFET. The study has been performed through simulation and measurements and is aimed at providing a systematic approach to aid in the extraction of accurate and efficient Cardiff behavioural models.
在功率放大器的设计中,有必要对晶体管在高压缩水平下的行为进行建模,并准确预测负载-拉功率和效率轮廓以及谐波。为此,非线性行为模型方法已被成功地使用,如卡迪夫模型。在本文中,系统地研究了针对GaN HFET的不同负载-拉力轮廓设计要求时,Cardiff模型达到给定精度所需的复杂性。该研究通过模拟和测量进行,旨在提供一种系统的方法来帮助提取准确有效的卡迪夫行为模型。
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引用次数: 4
期刊
2018 13th European Microwave Integrated Circuits Conference (EuMIC)
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