Reduction of surface roughness of GaP on Si substrate using strained GaInP interlayer by MOCVD

Rei Nishio, S. Tanabe, R. Suzuki, Kosuke Nemoto, T. Miyamoto
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Abstract

Epitaxial growth of GaP on a Si substrate with a GaInP interlayer by a low-pressure metalorganic chemical vapor deposition were investigated using the atomic force microscopy. The surface roughness Ra was decreased from 2.7 nm to 1.3 nm by only inserting the GaInP interlayer under the 600°C. The GaP layer using the GaInP interlayer was optimized under various growth temperature between 500°C and 650°C. The surface roughness Ra was drastically decreased to 0.5 nm when both the GaP and the GaInP interlayer was grown at 550°C.
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基于应变GaInP中间层的MOCVD降低Si衬底GaP表面粗糙度
利用原子力显微镜研究了在具有GaInP中间层的Si衬底上采用低压金属有机化学气相沉积法外延生长GaP。在600℃下,仅插入GaInP中间层,表面粗糙度Ra从2.7 nm降至1.3 nm。采用GaInP中间层的GaP层在500 ~ 650℃的不同生长温度下进行了优化。当GaP和GaInP中间层在550℃下生长时,表面粗糙度Ra急剧下降至0.5 nm。
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