{"title":"Technological Use Histories for Solder Metals","authors":"T. Graedel, J. Dong, Mao Jiansu","doi":"10.1109/ISEE.2006.1650061","DOIUrl":null,"url":null,"abstract":"Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEE.2006.1650061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion
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