Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650028
J. Isaacs, A. Tanwani, M. Healy
Assessment of environmental attributes of nanomanufacturing during process development will lead to development of competitive, safe and environmentally responsible manufacturing technologies. An environmental comparison of arc ablation, CVD and HiPco processes was undertaken by developing models for each process. Since no data are yet available for environmental or health impacts of single wall carbon nanotubes (SWNTs), the results from this analysis can only indicate the impact of resource and energy use during processing. Given the potential benefits and concerns over the use of SWNTs, and the fact that many new (and existing) businesses are currently working towards commercialization, assessment of the tradeoffs among the technological, environmental and economic characteristics is critical.
{"title":"Environmental Assessment of SWNT Production","authors":"J. Isaacs, A. Tanwani, M. Healy","doi":"10.1109/ISEE.2006.1650028","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650028","url":null,"abstract":"Assessment of environmental attributes of nanomanufacturing during process development will lead to development of competitive, safe and environmentally responsible manufacturing technologies. An environmental comparison of arc ablation, CVD and HiPco processes was undertaken by developing models for each process. Since no data are yet available for environmental or health impacts of single wall carbon nanotubes (SWNTs), the results from this analysis can only indicate the impact of resource and energy use during processing. Given the potential benefits and concerns over the use of SWNTs, and the fact that many new (and existing) businesses are currently working towards commercialization, assessment of the tradeoffs among the technological, environmental and economic characteristics is critical.","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124523464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650059
S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai
This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability
{"title":"Environmental Conservation Through Lead-Free Electronics Manufacturing","authors":"S. Ng, A. Vaidya, V. Venkataraman, B. Murcko, K. Srihari, R. Rai","doi":"10.1109/ISEE.2006.1650059","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650059","url":null,"abstract":"This paper discusses a research project to reduce and subsequently eliminate environmentally hazardous materials at a particular electronics manufacturer. In working with this industrial partner (a manufacturer of substrates and printed circuit board assemblies), the goal was to find a suitable lead-free alternative to the present SnPb alloy and also identify alternative lead free components. This strategy can serve as a blueprint for similar initiatives across the electronics manufacturing service (or EMS) provider spectrum. The evaluation and selection of a solder paste is extremely important and literature is replete with articles that address the critical nature of solder paste and its affect on yield and solder joint reliability","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124856054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650069
C. Herrmann, A. Frad, T. Luger, F. Krause, Z. Ragan
Today's product development is faced with an increasing pressure to reduce the time to market and respond to a growing quantity and complex design requirements. Besides economic aspects and customer requirements these requirements also comprise demands of new environmental legislation, such as the WEEE, RoHS and EUP directives by the European Union. These regulations force producers to take into account a product's life cycle performance already during the product development phase. This paper presents a new approach to improve the control of product requirements and its development process with the integration of the end-of-life oriented evaluation software ProdTect and the product conceptual design tool FOD. A washing machine is used as application example to demonstrate the advantages of this approach
{"title":"Integrating End-of-Life Evaluation in Conceptual Design","authors":"C. Herrmann, A. Frad, T. Luger, F. Krause, Z. Ragan","doi":"10.1109/ISEE.2006.1650069","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650069","url":null,"abstract":"Today's product development is faced with an increasing pressure to reduce the time to market and respond to a growing quantity and complex design requirements. Besides economic aspects and customer requirements these requirements also comprise demands of new environmental legislation, such as the WEEE, RoHS and EUP directives by the European Union. These regulations force producers to take into account a product's life cycle performance already during the product development phase. This paper presents a new approach to improve the control of product requirements and its development process with the integration of the end-of-life oriented evaluation software ProdTect and the product conceptual design tool FOD. A washing machine is used as application example to demonstrate the advantages of this approach","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"42 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122855072","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650082
Y. Jang, T. Townsend, Hyunmyung Yoon
The proper management of discarded electronic devices (often called electronic waste) is an emerging issue for solid waste professionals throughout the world because of the large growth of the waste stream, and the content of toxic metals in them, most notably heavy metals such as lead. Laptop computers are becoming one of the components of discarded electronic devices and will continue to increase in the waste stream in the future. The objective of this study was to examine leaching potential of metals from discarded laptop computers using the scale-up toxicity characteristic leaching procedure (TCLP), other standard leaching tests such as California waste extraction test (Cal WET), and the synthetic precipitation leaching procedure (SPLP) and actual landfill leachates as leaching solution. The results showed that the scale-up TCLP resulted in relatively high lead found in the leachate with an average of 23.3 mg/L. The average level was less than those by the standard TCLP and WET (37.0 mg/L and 86.0 mg/L, respectively), but much greater than those by the SPLP and the extractions with the landfill leachates (0.55 mg/L and 1.47 mg/L, respectively). All other target metals (Ag, As, Ba, Cd, Cr, Hg, Se) were found to be either less than or close to their detection limits. The pH of the leaching solution and the ability of the organic acids in the TCLP and WET to complex with lead were identified as major factors that controlled the amount of lead leached from laptop computers
{"title":"Evaluation of Metal Leaching from End-of-Life Laptop Computers Using the TCLP and Other Standard Leaching Tests","authors":"Y. Jang, T. Townsend, Hyunmyung Yoon","doi":"10.1109/ISEE.2006.1650082","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650082","url":null,"abstract":"The proper management of discarded electronic devices (often called electronic waste) is an emerging issue for solid waste professionals throughout the world because of the large growth of the waste stream, and the content of toxic metals in them, most notably heavy metals such as lead. Laptop computers are becoming one of the components of discarded electronic devices and will continue to increase in the waste stream in the future. The objective of this study was to examine leaching potential of metals from discarded laptop computers using the scale-up toxicity characteristic leaching procedure (TCLP), other standard leaching tests such as California waste extraction test (Cal WET), and the synthetic precipitation leaching procedure (SPLP) and actual landfill leachates as leaching solution. The results showed that the scale-up TCLP resulted in relatively high lead found in the leachate with an average of 23.3 mg/L. The average level was less than those by the standard TCLP and WET (37.0 mg/L and 86.0 mg/L, respectively), but much greater than those by the SPLP and the extractions with the landfill leachates (0.55 mg/L and 1.47 mg/L, respectively). All other target metals (Ag, As, Ba, Cd, Cr, Hg, Se) were found to be either less than or close to their detection limits. The pH of the leaching solution and the ability of the organic acids in the TCLP and WET to complex with lead were identified as major factors that controlled the amount of lead leached from laptop computers","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"303 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128626280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650027
Yi Li, K. Moon, C. Wong
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch interconnect capability (enabling the miniaturization of electronic devices). In this study, effects of nano silver (Ag) particles on electrical properties of ACA formulations were firstly investigated. It is discovered that nano silver (Ag) particles exhibited sintering behavior at significantly lower temperatures (<200°C) than the melting point (Tm of Ag is 960°C). The sintered nano Ag particles significantly reduced the ACA joint resistance and enhanced the current carrying capability of ACAs. In addition, a novel approach of self-assembled monolayers (SAMs) was used to treat nano Ag fillers to improve the interface properties of ACA joints. These SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were further improved due to the stronger bonding between nano fillers and SAM and consequently, it improved interface properties of the high performance ACA for potential microprocessor applications. This improvement enabled the possibility of replacing lead-containing solder interconnects in electronic industry.
{"title":"Novel nanotechnology for environmentally friendly interconnect materials in microelectronic packaging applications","authors":"Yi Li, K. Moon, C. Wong","doi":"10.1109/ISEE.2006.1650027","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650027","url":null,"abstract":"Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch interconnect capability (enabling the miniaturization of electronic devices). In this study, effects of nano silver (Ag) particles on electrical properties of ACA formulations were firstly investigated. It is discovered that nano silver (Ag) particles exhibited sintering behavior at significantly lower temperatures (<200°C) than the melting point (Tm of Ag is 960°C). The sintered nano Ag particles significantly reduced the ACA joint resistance and enhanced the current carrying capability of ACAs. In addition, a novel approach of self-assembled monolayers (SAMs) was used to treat nano Ag fillers to improve the interface properties of ACA joints. These SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were further improved due to the stronger bonding between nano fillers and SAM and consequently, it improved interface properties of the high performance ACA for potential microprocessor applications. This improvement enabled the possibility of replacing lead-containing solder interconnects in electronic industry.","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128665858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650061
T. Graedel, J. Dong, Mao Jiansu
Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion
{"title":"Technological Use Histories for Solder Metals","authors":"T. Graedel, J. Dong, Mao Jiansu","doi":"10.1109/ISEE.2006.1650061","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650061","url":null,"abstract":"Legislation in Europe as well as industry and consumer pressure has caused a shift from traditional tin-lead solder to lead-free solder. In this work, we examine five metals used or contemplated for use in electronic solders: tin and lead (the traditional solder metals), copper and silver (the metals added to tin in most non-leaded solders), and bismuth (a constituent of some specialty solders). History of use, current use, and potential effects of a transition to lead-free solder are the main topics of discussion","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134035085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650064
C. Hagelűken
The efficient recovery of precious and special metals from electronic scrap has significant benefits - economically, environmentally, but also under a resource conservation aspect. The yields of these metals could be substantially improved by higher collection rates, less scrap exports to regions with insufficient recycling structures, and by interface optimisation, as pointed out in this document
{"title":"Improving metal returns and eco-efficiency in electronics recycling - a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining","authors":"C. Hagelűken","doi":"10.1109/ISEE.2006.1650064","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650064","url":null,"abstract":"The efficient recovery of precious and special metals from electronic scrap has significant benefits - economically, environmentally, but also under a resource conservation aspect. The yields of these metals could be substantially improved by higher collection rates, less scrap exports to regions with insufficient recycling structures, and by interface optimisation, as pointed out in this document","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123506983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650090
R. Ladanyi, P. Miklosi
This paper aims to describe our work in the course of the liquid crystal display re-use and recycling (ReLCD) research project which financed by DG Research of European Commission (contract ndeg: COOP-CT-2003-508212). ReLCD includes organizations from 5 countries of European Union: Ecotronics and SAT GmbH from Austria, Active Disassembly Research Ltd from United Kingdom, RelektrA GmbH from Germany, Fundacion GAIKER from Spain and Bay Zoltan Foundation for Applied Research (BAY-LOGI) from Hungary. All members are deeply involved either in eco-efficient electr(on)ics or electr(on)ics recycling
{"title":"Functionality Test of End-of-Life TFT LCD Panels","authors":"R. Ladanyi, P. Miklosi","doi":"10.1109/ISEE.2006.1650090","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650090","url":null,"abstract":"This paper aims to describe our work in the course of the liquid crystal display re-use and recycling (ReLCD) research project which financed by DG Research of European Commission (contract ndeg: COOP-CT-2003-508212). ReLCD includes organizations from 5 countries of European Union: Ecotronics and SAT GmbH from Austria, Active Disassembly Research Ltd from United Kingdom, RelektrA GmbH from Germany, Fundacion GAIKER from Spain and Bay Zoltan Foundation for Applied Research (BAY-LOGI) from Hungary. All members are deeply involved either in eco-efficient electr(on)ics or electr(on)ics recycling","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126191247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650095
S. Stevović, Z. Durovic
Application of modern techniques of synthetic intelligence is also possible in the fields of the environment and sustainable development. This paper is dealing with the modern methods of synthetic intelligence, where the fuzzy expert system is developed and applied in the decision making process
{"title":"Environmental Impacts On HydroPower Solution Selection","authors":"S. Stevović, Z. Durovic","doi":"10.1109/ISEE.2006.1650095","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650095","url":null,"abstract":"Application of modern techniques of synthetic intelligence is also possible in the fields of the environment and sustainable development. This paper is dealing with the modern methods of synthetic intelligence, where the fuzzy expert system is developed and applied in the decision making process","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128376653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2006-05-08DOI: 10.1109/ISEE.2006.1650036
N. Darghouth, M. Blazek, D. Kammen
As renewable energy technologies (RET) continue to decline in price, they become an increasingly attractive option to power telecommunication facilities. By the dependence on the electric grid for power, such facilities face consequences of reduced reliability including risks of extended power failures, high environmental costs, and high capital costs for remote locations. Of the distributed power generation technologies, solar photovoltaics and wind turbines are the most mature technologies which could be used. Additional prospects exist for using fuel cells in the future and biofuels in developing countries. In developing countries, RET-powered telephone infrastructure have grown in acceptance and presents the possibility for two-way technology transfer between companies who have gained experience with these projects
{"title":"Alternative Power Generation Technologies: Use of Distributed Power for Telecommunications Facilities and Operations","authors":"N. Darghouth, M. Blazek, D. Kammen","doi":"10.1109/ISEE.2006.1650036","DOIUrl":"https://doi.org/10.1109/ISEE.2006.1650036","url":null,"abstract":"As renewable energy technologies (RET) continue to decline in price, they become an increasingly attractive option to power telecommunication facilities. By the dependence on the electric grid for power, such facilities face consequences of reduced reliability including risks of extended power failures, high environmental costs, and high capital costs for remote locations. Of the distributed power generation technologies, solar photovoltaics and wind turbines are the most mature technologies which could be used. Additional prospects exist for using fuel cells in the future and biofuels in developing countries. In developing countries, RET-powered telephone infrastructure have grown in acceptance and presents the possibility for two-way technology transfer between companies who have gained experience with these projects","PeriodicalId":141255,"journal":{"name":"Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006.","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127080865","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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