{"title":"Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements","authors":"U. Pfeiffer, A. Chandrasekhar","doi":"10.1109/EPEP.2003.1250004","DOIUrl":null,"url":null,"abstract":"We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.
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