Progress in high-power high-speed VCSEL arrays

SPIE OPTO Pub Date : 2016-03-18 DOI:10.1117/12.2215009
R. F. Carson, M. Warren, Preethi Dacha, Thomas E. Wilcox, J. Maynard, David J. Abell, Kirk J. Otis, J. Lott
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引用次数: 16

Abstract

Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.
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大功率高速VCSEL阵列的研究进展
倒装键合为vcsel的二维阵列提供了独特的结构。这种阵列具有可扩展的功率输出和单独寻址子阵列区域的能力,同时保持快速的打开和关闭响应时间。这些基板发射VCSEL阵列还可以利用集成微透镜进行光束整形和方向控制。本文将回顾这些激光阵列的性能进展,并讨论新兴的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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