Kazutaka Kasuga, Mitsuko Saito, Tsutomu Takeya, N. Miura, H. Ishikuro, T. Kuroda
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引用次数: 7
Abstract
This paper provides the method for Wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.
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