A D Band Zero Bias Detector Chip Using Schottky Diode

D. Ji, B. NIu, H. Tao, T. S. Chen, W. B. Wang
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Abstract

In this paper, a D band zero bias detector chip using InGaAs Schottky barrier diode (SBD) is proposed. The Schottky barrier diode with 3.5 THz cut-off frequency and 0.16 eV barrier height is realized based on the low barrier Schottky junction formed by contact between InGaAs and Ti. The detector chip is fabricated on a 50 micron InP substrate using the MMIC technology, and the microstrip structure is realized by processing the metal layer on the back of the InP substrate. The RF grounding of the Schottky barrier diode is completed by connecting the metal through hole with the back metal layer. The experimental results show that the voltage sensitivity of the D band detector chip is more than 2100 V/W in the range of D band, and more than 12000 V/W at 122 GHz, when the input RF power is −30 dBm.
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利用肖特基二极管的A - D波段零偏检测器芯片
本文提出了一种采用InGaAs肖特基势垒二极管(SBD)的D波段零偏检测器芯片。利用InGaAs与Ti接触形成的低势垒肖特基结,实现了截止频率为3.5 THz、势垒高度为0.16 eV的肖特基势垒二极管。探测器芯片采用MMIC技术制作在50微米的InP衬底上,并通过加工InP衬底背面的金属层来实现微带结构。肖特基势垒二极管的射频接地是通过将金属通孔与背面金属层连接来完成的。实验结果表明,当输入射频功率为- 30 dBm时,D波段检测器芯片在D波段范围内的电压灵敏度大于2100 V/W,在122 GHz时的电压灵敏度大于12000 V/W。
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