Challenges to the electronics packaging technologies for the volume integration of components in medical tools and instruments

David Wagner, B. Schmidt, M. Detert
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引用次数: 2

Abstract

The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. For example the functionalization of a catheter depends on different influence factors. The form factor takes the most important role. For a miniaturized and functional catheter tip, the diameter depends on the medical application. Other factors like the shape, reliability and also the cost must be considered. The paper shows the whole technology carrier of a medical product in relation to the field of electronics packaging. With the help of two examples the requirements for future products will be shown.
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电子封装技术在医疗工具和仪器的组件的体积集成的挑战
用于医疗应用的微系统技术中的电子封装包括各种任务。跨学科的方法是产品成功的最重要的基础。为了保证医疗微系统的可靠运行,必须考虑各种因素。例如,导管的功能化取决于不同的影响因素。外形因素扮演着最重要的角色。对于一个小型化和功能性的导管尖端,其直径取决于医疗应用。其他因素,如形状,可靠性和成本也必须考虑。本文从电子封装领域的角度,展示了医疗产品的整体技术载体。通过两个例子说明未来产品的需求。
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