An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) Pub Date : 2022-06-12 DOI:10.1109/vlsitechnologyandcir46769.2022.9830188

Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, M. Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, S. Sheu, Hung-Ming Chen, Kuan-Neng Chen, W. Lo, Chih-I Wu

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引用次数: 1

Abstract

2.5D/3D integration combines multiple dies or chiplets into a single package through a silicon interposer and through-silicon-vias (TSVs). However, the wire routing of redistribution layer (RDL) on an interposer is time-consuming and expensive. Therefore, this work demonstrates the first programmable 2.5D/3D integration by an embedded multi-die active bridge (EMAB) chip for fast 2.5D/3D prototype proof. The EMAB chip is a programmable bridge and realized by a checkboard and super highways to connect I/Os of multiple dies. The control of programmable switches in EMAB is based on the information stored in the one-time programming (OTP) memory. To further improving the data rates of switches in the checkboard and super highway, a forward body-bias control is utilized to reduce the turn-on resistance. The maximum data rate of the super highway is up to 1Gbps and the data rate of the checkboard is 100Mbps through 20 I/O blocks. The proposed programmable advanced package technology is a fast time-to-market and low-cost 2.5D/3D integration solution for various IoT applications.

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用于快速原型可编程2.5D/3D封装技术的嵌入式多模有源桥接(EMAB)芯片

2.5D/3D集成将多个晶片或芯片通过硅中间层和硅通孔(tsv)集成到单个封装中。然而，中间层上的重新分配层(RDL)的布线既耗时又昂贵。因此，这项工作通过嵌入式多模有源电桥(EMAB)芯片演示了第一个可编程2.5D/3D集成，用于快速2.5D/3D原型验证。EMAB芯片是一个可编程的桥接电路，通过棋盘和高速公路实现多个芯片的I/ o连接。EMAB中可编程开关的控制是基于存储在一次性编程(OTP)存储器中的信息。为了进一步提高检查板和高速公路上的开关的数据速率，采用正向体偏控制来减小导通电阻。高速公路的最大数据速率可达1Gbps，通过20个I/O块，校验板的数据速率可达100Mbps。提出的可编程先进封装技术是一种快速上市和低成本的2.5D/3D集成解决方案，适用于各种物联网应用。

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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

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