Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic- Electro-Thermal Behavior of Power Conversion System During Load Operation” [ASME J. Electron. Packag., 2023, 145(2), p. 021005; DOI: 10.1115/1.4055591]
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期刊介绍：
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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