Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials

Abstract

In this paper, a variable density topology optimization method is used to design a high thermal conductivity path structure for efficient heat dissipation. The temperature and stiffness in the module volume are taken as the objective function. Simulations are carried out to compare with a high-power electronics device heat dissipation. The heat dissipation performance (HDP) of structures optimized topologically is further enhanced through the use of auxiliary materials, including highly thermally conductive coating material and phase change material (PCM). The efficient heat dissipation of the constructed topology optimization model and the effectiveness of the proposed method are verified.