Thermal conductivity enhancement of aluminum scandium nitride grown by molecular beam epitaxy

IF 8.6 1区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Research Letters Pub Date : 2023-11-14 DOI:10.1080/21663831.2023.2279667
Gustavo A. Alvarez, Joseph Casamento, Len van Deurzen, Md Irfan Khan, Kamruzzaman Khan, Eugene Jeong, Elaheh Ahmadi, Huili Grace Xing, Debdeep Jena, Zhiting Tian
{"title":"Thermal conductivity enhancement of aluminum scandium nitride grown by molecular beam epitaxy","authors":"Gustavo A. Alvarez, Joseph Casamento, Len van Deurzen, Md Irfan Khan, Kamruzzaman Khan, Eugene Jeong, Elaheh Ahmadi, Huili Grace Xing, Debdeep Jena, Zhiting Tian","doi":"10.1080/21663831.2023.2279667","DOIUrl":null,"url":null,"abstract":"Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates.","PeriodicalId":18291,"journal":{"name":"Materials Research Letters","volume":"37 23","pages":"0"},"PeriodicalIF":8.6000,"publicationDate":"2023-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Research Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/21663831.2023.2279667","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Aluminum scandium nitride (AlScN) has been receiving increasing interest for radio frequency microelectromechanical systems because of their higher achievable bandwidths owing to the larger piezoelectric response of AlScN compared to AlN. However, alloying scandium (Sc) with aluminum nitride (AlN) significantly lowers the thermal conductivity of AlScN due to phonon alloy scattering. Self-heating in AlScN devices potentially limits power handling, constrains the maximum transmission rate, and ultimately leads to thermal failure. We grew plasma-assisted molecular beam epitaxy (PAMBE) AlScN on AlN-Al2O3 and GaN-Al2O3 substrates, and compared the cross-plane thermal conductivity to current work on AlScN grown on Si substrates.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
分子束外延生长氮化铝钪的热导率增强
氮化铝钪(AlScN)越来越受到射频微机电系统的关注,因为与AlN相比,AlScN具有更大的压电响应,从而具有更高的可实现带宽。然而,将钪(Sc)与氮化铝(AlN)合金化后,由于声子合金的散射,AlScN的导热系数显著降低。AlScN器件中的自加热可能会限制功率处理,限制最大传输速率,并最终导致热故障。我们在AlN-Al2O3和GaN-Al2O3衬底上生长了等离子体辅助分子束外延(PAMBE) AlScN,并将其与目前在Si衬底上生长的AlScN的平面导热性进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Materials Research Letters
Materials Research Letters Materials Science-General Materials Science
CiteScore
12.10
自引率
3.60%
发文量
98
审稿时长
3.3 months
期刊介绍: Materials Research Letters is a high impact, open access journal that focuses on the engineering and technology of materials, materials physics and chemistry, and novel and emergent materials. It supports the materials research community by publishing original and compelling research work. The journal provides fast communications on cutting-edge materials research findings, with a primary focus on advanced metallic materials and physical metallurgy. It also considers other materials such as intermetallics, ceramics, and nanocomposites. Materials Research Letters publishes papers with significant breakthroughs in materials science, including research on unprecedented mechanical and functional properties, mechanisms for processing and formation of novel microstructures (including nanostructures, heterostructures, and hierarchical structures), and the mechanisms, physics, and chemistry responsible for the observed mechanical and functional behaviors of advanced materials. The journal accepts original research articles, original letters, perspective pieces presenting provocative and visionary opinions and views, and brief overviews of critical issues.
期刊最新文献
Microstructural evolution and toughening mechanism of WC-Co composite prepared by amorphous-crystallization method Eliminate the contradiction between temperature and toughness by grain-boundary delamination in heterogeneous ultrafine-grained lamellar steels The activation of multiple slip systems in polycrystalline zirconium by using automated lattice rotation framework A novel atomic mechanism of fcc → hcp → bcc phase transition in a gradient nanostructured compositionally complex alloy Unraveling the origin of ductility in multilayered Ti/Nb composites: role of dislocation evolution
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1