Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-11-01 DOI:10.1115/1.4063541
Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael Azarian, Daniel Hines, Siddhartha Das, Abhijit Dasgupta
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Abstract

Abstract Aerosol-Jet Printing (AJP) technology, applied to the manufacturing of printed hybrid electronics (PHE) devices, has the capability to fabricate highly complex structures with resolution in the tens-of-microns scale, creating new possibilities for the fabrication of electronic devices and assemblies. The widespread use of AJP in fabricating PHE and package-level electronics necessitates a thorough assessment of not only the performance of AJP printed electronics but also their reliability under different kinds of life-cycle operational and environmental stresses. One important hindrance to the reliability and long-term performance of such AJP electronics is electrochemical migration (ECM). ECM is an important failure mechanism in electronics under temperature and humidity conditions because it can lead to conductive dendritic growth, which can cause dielectric breakdown, leakage current, and unexpected short circuits. In this paper, the ECM propensity in conductive traces printed with AJP process, using silver-nanoparticle (AgNP) based inks, was experimentally studied using temperature-humidity-bias (THB) testing of printed test coupons. Conductive dendritic growth with complex morphologies was observed under different levels of temperature, humidity, and electric bias in the THB experiments. Weibull statistics are used to quantify the failure data, along with the corresponding confidence bounds to capture the uncertainty of the Weibull distribution. A nonmonotonic relationship between time-to-failure and electric field strength was noticed. An empirical acceleration model for ECM is proposed, by combining the classical Peck's model with a quadratic polynomial dependence on electric field strength. This model provides good estimate of acceleration factors for use conditions where the temperature, humidity, and electrical field are within the tested range, but should be extrapolated with care beyond the tested range.
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气溶胶-喷射印刷电路中电化学迁移的温度-湿度偏差测试和寿命预测模型
气溶胶喷射打印(AJP)技术应用于印刷混合电子(PHE)器件的制造,具有制造分辨率在几十微米级的高度复杂结构的能力,为电子器件和组件的制造创造了新的可能性。AJP在制造PHE和封装级电子产品中的广泛应用,不仅需要对AJP印刷电子产品的性能进行全面评估,还需要对其在不同生命周期操作和环境应力下的可靠性进行全面评估。影响此类AJP电子器件可靠性和长期性能的一个重要障碍是电化学迁移(ECM)。ECM是温度和湿度条件下电子器件的重要失效机制,因为它会导致导电枝晶生长,从而导致介电击穿、泄漏电流和意外短路。本文采用基于银纳米颗粒(AgNP)的油墨,通过温度-湿度偏置(THB)测试,实验研究了AJP工艺印刷的导电痕迹中的ECM倾向。在不同的温度、湿度和电偏置条件下,观察到导电枝晶生长具有复杂的形貌。采用威布尔统计量对失效数据进行量化,并给出相应的置信区间来捕捉威布尔分布的不确定性。失效时间与电场强度之间存在非单调关系。将经典的Peck模型与电场强度的二次多项式依赖关系相结合,提出了一种经验加速度模型。该模型为温度、湿度和电场在测试范围内的使用条件提供了很好的加速因子估计,但在超出测试范围时应小心外推。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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