Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-11-10 DOI:10.1115/1.4063252
R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff
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Abstract

Abstract A thermosyphon-based modular cooling approach offers an energy efficient cooling solution with an increased potential for waste heat recovery. Central to the cooling system is an air-refrigerant finned tube heat exchanger (HX), where air is cooled by evaporating refrigerant. This work builds on a previously published two-dimensional (2D) model for the finned-tube HX by updating and validating the model using in-house experimental data collected from the proposed system using R1233zd(E) as the working fluid. The results show that key system variables such as refrigerant outlet quality, air and refrigerant outlet temperatures, and exchanger duty agree within 20% of their experimental counterparts. The validated model is then used to predict the mean heat transfer coefficient on the refrigerant side for each tube in the direction of airflow, indicating a maximum heat transfer coefficient of nearly 1200 W/(m2 K) for a HX duty of 5.3 kW among the tested cases. The validated model therefore enables accurate predictions of HX performance and provides insights into improving the heat exchange efficiency and the corresponding system performance.
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机架级冷却翅片管换热器模型的验证与应用
基于热虹吸的模块化冷却方法提供了一种节能的冷却解决方案,增加了废热回收的潜力。冷却系统的中心是空气制冷剂翅片管热交换器(HX),其中空气通过蒸发制冷剂冷却。这项工作建立在之前发表的翅片管HX的二维(2D)模型的基础上,通过使用从R1233zd(E)作为工作流体的拟议系统收集的内部实验数据来更新和验证模型。结果表明,制冷剂出口质量、空气和制冷剂出口温度、换热器负荷等关键系统变量与实验值的一致性在20%以内。然后利用验证的模型预测了气流方向上各管制冷剂侧的平均换热系数,结果表明,在HX占空率为5.3 kW的测试用例中,最大换热系数接近1200 W/(m2 K)。因此,经过验证的模型能够准确预测HX性能,并为提高热交换效率和相应的系统性能提供见解。
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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