Highly Reproducible and Reliable Methanol Sensor Based on Hydrothermally Grown TiO2 Nanoparticles

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Device and Materials Reliability Pub Date : 2023-10-23 DOI:10.1109/TDMR.2023.3326778
Nikita Kar Chowdhury;Aditya Kumar Singh;Arnab Hazra;Basanta Bhowmik
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Abstract

In the present paper, $TiO_{2}$ nanoparticles were synthesized through low cost hydrothermal method at 150°C. Structural, morphological and optical properties of the grown materials were characterized through X-ray diffraction (XRD), Field emission scanning electron microscopy (FESEM), Raman Spectroscopy, and Photoluminescence spectroscopy, respectively. X-ray diffraction confirms the anatase phase with average crystalline size of 6.8 nm. Non-uniform particles having numerous pores with large number of active sites offered superior capability to detect methanol even at lower concentrations. Band gap of the material were found to be 3.4 eV. $TiO_{2}$ nanoparticles in planner structure were investigated towards methanol (1-100 ppm) at the temperature ranging from (25-150°C). Sensor was found to be maximum responsive with response magnitude of 85% at 100°C and 47% at room temperature towards 100 ppm of methanol. At 1 ppm of methanol, sensor response was found to be 20%. Sensor response towards methanol was correlated with the surface state of nanoparticles with HOMO-LUMO energy.
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基于水热生长TiO2纳米颗粒的高可重复性和可靠性甲醇传感器
本文采用低成本水热法在150℃下合成了$TiO_{2}$纳米粒子。通过x射线衍射(XRD)、场发射扫描电镜(FESEM)、拉曼光谱(Raman Spectroscopy)和光致发光光谱(Photoluminescence Spectroscopy)分别表征了生长材料的结构、形态和光学性质。x射线衍射证实为锐钛矿相,平均晶粒尺寸为6.8 nm。具有大量活性位点的多孔非均匀颗粒即使在较低浓度下也具有优越的检测甲醇的能力。该材料的带隙为3.4 eV。在25 ~ 150℃的温度范围内,研究了计划器结构的$TiO_{2}$纳米颗粒对甲醇(1 ~ 100 ppm)的反应。当甲醇浓度为100 ppm时,传感器的响应幅度最大,在100°C时为85%,在室温时为47%。当甲醇浓度为1ppm时,传感器响应率为20%。传感器对甲醇的响应与具有HOMO-LUMO能量的纳米颗粒的表面状态相关。
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来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
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